Technology for Innovators
We develop Technology for Innovators™. TI’s strategic focus is on Digital Signal Processing (DSP) and high performance analog, which are the key technologies fueling innovative, high-growth applications for many of today's fastest growing markets. These markets include digital wireless, broadband access, digital audio and high-resolution imaging.
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DSP is ideal for applications where delays cannot be tolerated. These special microprocessors perform mathematical computations instantaneously with a high level of precision that makes them well suited for real-time processing. TI DSPs are
used to process a vast assortment of information—including sound, images and video.
Digital end equipment using DSPs, like cell phones and digital still cameras, require analog chips that act as translators to change sound or light—real-world signals—into the 1s and 0s of the digital world. DSPs compress and process these
digital signals instantaneously.
TI’s DSP and high-performance analog combinations are brought together to create innovative solutions for both today and tomorrow. These solutions make access to the Internet faster, Internet Protocol (IP) possible, the sound on cellular phones clearer, and video and Internet features available on third generation (3G) wireless phones.
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High performance analog chips are an essential element of almost all applications in today’s digital world. Analog products convert real-world signals, such as voice, sound, pressure, temperature and electricity, into the 1s and 0s of the digital world. Here, the digital signals can be processed very quickly by DSPs and converted back to the real-world signals we can understand.
TI’s premier portfolio of data converters, amplifiers, power management and interface products for high performance and low power applications is among the industry’s strongest. Our expertise in the latest, high performance analog technologies is enabling innovative applications in the communications, consumer electronics, industrial, computing, automotive and medical markets.
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Addressing the ever-increasing need for efficiency and flexibility, TI’s Application Specific Integrated Circuit (ASIC) business focuses on building integrated system-on-a-chip (SoC) systems for high-volume end equipments that require high performance or low power.
By building custom devices to fit specific needs, TI enables its customers to create and deliver cost effective, differentiated products with reduced cycle times and faster overall time to market.
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As the world’s leading Logic supplier, TI provides a full spectrum of functions and technologies including Bipolar and BiCMOS families along with advanced CMOS families. Our industry-leading Lead (Pb)-Free package offerings, coupled with our advanced process technologies, offer the performance and features required for the logic designs of today and tomorrow while maintaining support for traditional logic products.
We offer specialized logic devices that improve overall system performance and address design issues such as smaller form factors, reliability and power consumption.
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End-Equipment Solutions
TI is the leading provider of semiconductor solutions for the high-growth wireless, broadband and consumer electronics markets. As the consumer electronics and communications markets continue to intersect, we are best positioned to deliver the most complete broadband and wireless communications portfolio.
As the leading manufacturer of wireless semiconductors for more than 15 years, TI delivers the foundation of today’s wireless technology while driving innovations that will enable the next generation of mobility. From traditional voice-centric mobile phones, to the most advanced, application-rich 3G devices, TI delivers a broad range of complete semiconductor and software solutions to meet the requirements of the world’s leading handset manufacturers, mobile operators and applications software developers.
Worldwide, more than 2 billion mobile handsets have shipped with a TI digital baseband inside. We’ve shipped more than 400 million 2G/2.5G cellular system chipsets to more than 58 customers. And six of the top seven global 3G handset manufacturers use TI wireless solutions.
TI’s wireless division continues to innovate, delivering some of the industry’s most advanced integration technology. Innovations such as the single-chip cell phone solution are allowing the company to enter and create new markets with a range of solutions delivering everything from digital TV on the handset to smaller, more affordable phones in emerging markets.
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The demand for high-speed, always on connections has kept the number of broadband subscribers growing rapidly around the world. This trend is expected to continue as the communications and entertainment era grows, and connectivity moves into a wider range of consumer electronics devices. In fact, market research firm iSuppli predicts the number of networked households to nearly triple by 2010 to 162 million globally. Estimated growth to connected devices from approximately 196 million to 974 million is also anticipated.
TI’s broadband solutions range from infrastructure to end points, including DSL, wireless LAN (WLAN), cable, video and Voice over Internet Protocol (VoIP). In addition to these traditional broadband offerings, TI is uniquely positioned to combine these technologies and deliver highly differentiated, innovative, interoperable solutions to customers. As more people experience the benefits of high-speed connections in their homes, and can access that bandwidth through their homes for video, voice and data service, TI expects to continue to gain strength in this growing market.
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As home and office networking continues to gain momentum, wireless LAN technology becomes increasingly significant. With IEEE 802.11b (also known as Wi-Fi™) and Bluetooth™, consumers can connect their homes and offices using “no wire” networks, which connect multiple PCs, peripherals and other Internet appliances to rich content that includes voice, data and video information.
As a leader in Wi-Fi and Bluetooth technologies, TI is well positioned to drive silicon and software trends toward higher data rates, while maintaining the highest performance levels.
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Wireless service providers have invested heavily in developing the marketplace by purchasing bandwidth to deliver next-generation, media-rich services. With unmatched systems expertise for customer-driven solutions and TI’s comprehensive portfolio of wireless infrastructure products, OEMs can get everything they need to enable specific system-level solutions for wireless infrastructure applications and distinguish their products in the competitive marketplace.
That’s why today, nine out of the top ten leading 3G base station manufacturers use TI solutions for their next-generation systems. TI technology connects the world by helping customers create new revenue streams and accelerates the delivery of new wireless technologies.
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TI is driving many of today’s hottest consumer electronics products. You’ll find TI DSP and analog technology inside the latest video, imaging and audio products from the world’s leading manufacturers. From digital radio, portable audio and multimedia players to digital cameras, streaming set-top boxes, AV receivers, home theater audio systems and automotive infotainment, TI technology is enabling products that are smaller, smarter, faster and friendlier.
Whether it’s small size and form, high performance and features, support for multiple standards or longer battery life, TI provides the platform that’s fueling the consumer electronics revolution.
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TI’s exciting video and imaging solutions for wired digital media features an array of multimedia applications including video encoders and decoders, video surveillance cameras, video conferencing gateways, residential media servers, IP videophones and IP-based set-top boxes with personal video recorder capability. We also provide statistical multiplexers and wireless video and DSL gateways.
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TI’s digital control applications allow designers of white goods, power supplies, tunable lasers, automotive electronics, consumer electronics and industrial applications to implement advanced, cost-efficient control systems.
Our broad base of control-optimized silicon provides the industry's highest level of on-chip integration and powerful computational abilities that drive system costs down to unprecedented levels. This unique combination of DSP-based processing power and control-specific peripherals delivers higher motor efficiency, quieter operation, lower energy consumption and greater reliability compared to conventional microprocessor solutions.
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The Radio Frequency Identification (TI-RFid™) business provides automated asset identification, management and data collection solutions. Applications for RFID technology include everything from pay at the pump gasoline sales and vehicle security, to identification and tracking of retail goods, livestock and library books.
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Our Technology and Manufacturing Group Makes the Difference
TI is one of the few companies that have made the necessary investments to remain among the semiconductor manufacturing elite in the world. Our worldwide technology and manufacturing organization develops and produces an extremely large variety of leading-edge devices that can meet demanding customer specifications.
The people in our worldwide wafer fabrication and assembly/test facilities transform raw silicon wafers into quality packaged chips that are vital for products that are as diverse as cellular phones, audio/video equipment, automotive gear and high-performance computing systems.
TI’s newly built, state-of-the-art semiconductor manufacturing complex in Richardson, Texas is designed to build some of the world’s most advanced semiconductor product designs on 300 millimeter (12-inch) diameter silicon wafers with TI’s 45 nanometer (nm) process technology.
Such leadership technologies and innovative manufacturing processes allow our Technology and Manufacturing Group to provide TI with a competitive advantage for present and future products.
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Beginning with the introduction of the TI-81 graphing calculator more than 15 years ago, TI has become one of the top technology choices among math and science educators and students. Our successful practice of involving educators at every step of product development, and building our technology based on the latest and best available pedagogical research, has enabled ET to answer the needs of education with the most appropriate and effective technology.
In addition, TI has forged relationships with national educational entities and education-focused organizations where our jointly-developed initiatives continue to enhance teaching and learning.
In math and science education, TI ET is unique in offering educators the best value by providing everything needed for their successful implementation of research-based technology designed to improve student achievement – the tools, the training and the curricular materials, as well as other support programs.
ET continues to grow and succeed as we strive to help educators inspire all students to achieve their potential and become the innovators of tomorrow.
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TI’s DLP® technology is revolutionizing the world of big-screen HDTVs, projectors and cinema by delivering a picture that is so razor sharp, so lifelike and real it’s like being there. This extremely versatile picture technology enables the world’s smallest projectors under two pounds, yet can light up the largest movie screens from up to 75 feet away.
At the heart of DLP technology is the remarkable DLP chip which uses an array of up to 2.2 million micromirrors to reproduce images with razor sharp, digital precision. More than 75 companies, representing virtually all of the world’s top projection and HDTV manufacturers have products based on DLP technology.
As the sought-after picture technology in leading HDTVs and projectors, DLP technology has grown into a true consumer brand. To further the recognition of the brand, TI is investing in significant TV advertising and the sponsorship of the NASCAR #96 race car.
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