Product details

Technology family CD4000 Function Encoder Configuration 8:3 Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Military
Technology family CD4000 Function Encoder Configuration 8:3 Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 16 135.3552 mm² 19.56 x 6.92
  • Converts from 1 of 8 to binary
  • Provides cascading feature to handle any number of inputs
  • Group select indicates one or more priority inputs
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range):
         0.5 V at VDD = 5 V
         1.5 V at VDD = 10 V
         1.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
  • Applications:
    • Priority encoder
    • Binary or BCD encoder (keyboard encoding)
    • Floating point arithmetic

Data sheet acquired from Harris Semiconductor

  • Converts from 1 of 8 to binary
  • Provides cascading feature to handle any number of inputs
  • Group select indicates one or more priority inputs
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range):
         0.5 V at VDD = 5 V
         1.5 V at VDD = 10 V
         1.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
  • Applications:
    • Priority encoder
    • Binary or BCD encoder (keyboard encoding)
    • Floating point arithmetic

Data sheet acquired from Harris Semiconductor

CD4532B consists of combinational logic that encodes the highest priority input (D7-D0) to a 3-bit binary code. The eight inputs, D7 through D0, each have an assigned priority; D7 is the highest priority and D0 is the lowest. The priority encoder is inhibited when the chip-enable input EI is low. When EI is high, the binary representation of the highest-priority input appears on output lines Q2-Q0, and the group select line GS is high to indicate that priority inputs are present. The enable-out (EO) is high when no priority inputs are present. If any one input is high, EO is low and all cascaded lower-order stages are disabled.

The CD4532B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4532B consists of combinational logic that encodes the highest priority input (D7-D0) to a 3-bit binary code. The eight inputs, D7 through D0, each have an assigned priority; D7 is the highest priority and D0 is the lowest. The priority encoder is inhibited when the chip-enable input EI is low. When EI is high, the binary representation of the highest-priority input appears on output lines Q2-Q0, and the group select line GS is high to indicate that priority inputs are present. The enable-out (EO) is high when no priority inputs are present. If any one input is high, EO is low and all cascaded lower-order stages are disabled.

The CD4532B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 7
Type Title Date
* Data sheet CD4532B TYPES datasheet (Rev. C) 13 Oct 2003
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 03 Dec 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
CDIP (J) 16 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos