OMAP3503 Status: ACTIVE

Applications Processor

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Datasheet

OMAP3515/03 Applications Processor (Rev. E) (PDF 3731 KB)
18 Aug 2009
OMAP3530/25/15/03 Applications Processor Silicon Errata-Revs 3.1, 3.0, 2.1,&2.0 (Rev. D) (PDF 512 KB) 13943 views
18 Mar 2009
OMAP35x Linux PSP Data Sheet (PDF 1599 KB) 740 views
16 Oct 2009

Functional Block Diagram

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	OMAP3503
CPU	ARM Cortex-A8
RISC Frequency(MHz)	600
On-Chip L1/SRAM	32 KB (ARM Cortex-A8)
RAM	64 KB
On-Chip L2/SRAM	256 KB (ARM Cortex-A8)
ROM	32 KB (ARM Cortex-A8)
EMIF	1 32-Bit SDRC,1 16-Bit GPMC
External Memory Type Supported	LPDDR,NOR Flash,NAND flash,OneNAND,Asynch SRAM
DMA	64-Ch EDMA,32-Bit Channel SDMA
Video Port (Configurable)	1 Dedicated Output,1 Dedicated Input
MMC/SD	3
McBSP	5
Pin/Package	423FCBGA, 515POP-FCBGA
POP Interface	Yes (CBB)
I2C	3
McSPI	4
HDQ/1-Wire	1
UART	3
USB	2
Timers	12 32-Bit GP,2 32-Bit WD
Core Supply (Volts)	0.8 V to 1.35 V
IO Supply (Volts)	1.8 V,3.0 V (MMC1 Only)
Operating Temperature Range (°C)	0 to 90,-40 to 105
	Samples
	Inventory

Customers Who Evaluated This Product Also Evaluated

OMAP3530: Applications Processor
OMAP3525: Applications Processor
OMAP3515: Applications Processor
OMAP-L138: Low-Power Applications Processor
OMAP-L137: Low-Power Applications Processor
TPS65950: Integrated Power Management IC with 3 DC/DC's, 11 LDO's, Audio Codec, USB HS Transceiver, Charger

Product Information

Features

OMAP3515/03 Applications Processor:
- OMAP™ 3 Architecture
- MPU Subsystem
  - Up to 720-MHz ARM Cortex™-A8 Core
  - NEON™ SIMD Coprocessor
- POWERVR SGX™ Graphics Accelerator (OMAP3515 Device Only)
  - Tile Based Architecture delivering 10 MPoly/sec
  - Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
  - Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
  - Fine Grained Task Switching, Load Balancing, and Power Management
  - Programmable High Quality Image Anti-Aliasing
- Fully Software-Compatible With ARM9™
- Commercial and Exteneded Temperature Grades
ARM Cortex™-A8 Core
- ARMv7 Architecture
  - Trust Zone®
  - Thumb®-2
  - MMU Enhancements
- In-Order, Dual-Issue, Superscalar Microprocessor Core
- NEON™ Multimedia Architecture
- Over 2x Performance of ARMv6 SIMD
- Supports Both Integer and Floating Point SIMD
- Jazelle® RCT Execution Environment Architecture
- Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
- Embedded Trace Macrocell (ETM) Support for Non-Invasive Debug
ARM Cortex™-A8 Memory Architecture:
- 16K-Byte Instruction Cache (4-Way Set-Associative)
- 16K-Byte Data Cache (4-Way Set-Associative)
- 256K-Byte L2 Cache
112K-Byte ROM
64K-Byte Shared SRAM
Endianess:
- ARM Instructions - Little Endian
- ARM Data — Configurable
External Memory Interfaces:
- SDRAM Controller (SDRC)
  - 16, 32-bit Memory Controller With 1G-Byte Total Address Space
  - Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM
  - SDRAM Memory Scheduler (SMS) and Rotation Engine
- General Purpose Memory Controller (GPMC)
  - 16-bit Wide Multiplexed Address/Data Bus
  - Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
  - Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
  - Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
  - Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)
System Direct Memory Access (sDMA) Controller (32 Logical Channels With Configurable Priority)
Camera Image Signal Processing (ISP)
- CCD and CMOS Imager Interface
- Memory Data Input
- RAW Data Interface
- BT.601/BT.656 Digital YCbCr 4:2:2 (8-/16-Bit) Interface
- A-Law Compression and Decompression
- Preview Engine for Real-Time Image Processing
- Glueless Interface to Common Video Decoders
- Histogram Module/Auto-Exposure, Auto-White Balance, and Auto-Focus Engine
- Resize Engine
  - Resize Images From 1/4x to 4x
  - Separate horizontal/Vertical Control
Display Subsystem
- Parallel Digital Output
  - Up to 24-Bit RGB
  - HD Maximum Resolution
  - Supports Up to 2 LCD Panels
  - Support for Remote Frame Buffer Interface (RFBI) LCD Panels
- 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
  - Composite NTSC/PAL Video
  - Luma/Chroma Separate Video (S-Video)
- Rotation 90-, 180-, and 270-degrees
- Resize Images From 1/4x to 8x
- Color Space Converter
- 8-bit Alpha Blending
Serial Communication
- 5 Multichannel Buffered Serial Ports (McBSPs)
  - 512 Byte Transmit/Receive Buffer (McBSP1/3/4/5)
  - 5K-Byte Transmit/Receive Buffer (McBSP2)
  - SIDETONE Core Support (McBSP2 and 3 Only) For Filter, Gain, and Mix Operations
  - Direct Interface to I2S and PCM Device and TDM Buses
  - 128 Channel Transmit/Receive Mode
- Four Master/Slave Multichannel Serial Port Interface (McSPI) Ports
- High-Speed/Full-Speed/Low-Speed USB OTG Subsystem (12-/8-Pin ULPI Interface)
- High-Speed/Full-Speed/Low-Speed Multiport USB Host Controller
  - 12-/8-Pin ULPI Interface or 6-/4-/3-Pin Serial Interface
  - Supports Transceiverless Link Logic (TLL)
- One HDQ/1-Wire Interface
- Three UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
- Three Master/Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
Removable Media Interfaces:
- Three Multimedia Card (MMC)/ Secure Digital (SD) With Secure Data I/O (SDIO)
Comprehensive Power, Reset, and Clock Management
- SmartReflex™ Technology
- Dynamic Voltage and Frequency Scaling (DVFS)
Test Interfaces
- IEEE-1149.1 (JTAG) Boundary-Scan Compatible
- Embedded Trace Macro Interface (ETM)
- Serial Data Transport Interface (SDTI)
11 32-bit General Purpose Timers
2 32-bit Watchdog Timers
1 32-bit 32-kHz Sync Timer
Up to 188 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
65-nm CMOS Technology
Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
Descreet Memory Interface (Not Available in CBC Package)
Packages:
- 515-pin s-PBGA Package (CBB Suffix), .5mm Ball Pitch (Top), .4mm Ball Pitch (Bottom)
- 515-pin s-PBGA Package (CBC Suffix), .65mm Ball Pitch (Top), .5mm Ball Pitch (Bottom)
- 423-pin s-PBGA Package (CUS Suffix), .65mm Ball Pitch
1.8-V I/O and 3.0-V (MMC1 only), 0.975-V to 1.35-V Adaptive Processor Core Voltage, 0.975-V to 1.35-V Adaptive Core Logic Voltage
Applications:
- Portable Navigation Devices
- Portable Media Player
- Advanced Portable consumer Electronics
- Digital TV
- Digital Video Camera
- Portable Data Collection
- Point-of-Sale Devices
- Gaming
- Web Tablet
- Smart White Goods
- Smart Home Controllers
- Ultra Mobile Devices

POWERVR SGX is a trademark of Imagination Technologies Ltd.

OMAP is a trademark of Texas Instruments

All trademarks are the property of their respective owners.

Description

OMAP3515 and OMAP3503 high-performance, applications processors are based on the enhanced OMAP™ 3 architecture.

The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

Streaming video
3D mobile gaming
Video conferencing
High-resolution still image

The device supports high-level operating systems (OSs), such as:

Linux
Windows CE

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor
POWER SGX ™ subsystem for 3D graphics acceleration to support display and gaming effects (3515 only)
Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out.
Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex™ adaptative voltage control. This power management technique for automatic control of the operating voltage of a module reduces the active power consumption.
Memory stacking feature using the package-on-package (POP) implementation (CBB package only)

OMAP3515/03 devices are available in a 515-pin PBGA package (CBB suffix) and a 423-pin PBGA package (CUS suffix). Some features of the CBB package are not available in the CUS package.

Pricing / Packaging / CAD Design Tools / Samples

		Price	Packaging		Samples
Device	Status	Price \| Quantity	Package \| Pins	Package QTY \| Package Carrier	Samples
OMAP3503DCBB	ACTIVE	24.90 \| 100u	POP-FCBGA (CBB) \| 515	168	Purchase Samples
OMAP3503DCBBA	ACTIVE	29.90 \| 100u	POP-FCBGA (CBB) \| 515	168	Purchase Samples
OMAP3503DCBC	ACTIVE	24.90 \| 100u	POP-FCBGA (CBC) \| 515	119	Purchase Samples
OMAP3503DCUS	ACTIVE	24.90 \| 100u	FCBGA (CUS) \| 423	90	Purchase Samples

* Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For higher volume price quotes,prices in local currency or delivery quotes, please contact your local Texas Instruments Sales Office or Authorized Distributor.

Inventory

Reported Distributor Inventory as of 11:40 AM GMT, 06 Nov 2009
Region	Company	In Stock	Purchase
TI Lead Time*: 12 WeeksOMAP3503DCBB
Americas	Arrow	68
Worldwide	DigiKey	>1k
TI Lead Time*: 12 WeeksOMAP3503DCBBA
None Reported View Distributors
TI Lead Time*: 12 WeeksOMAP3503DCBC
Americas	Arrow	88
	Avnet	345
TI Lead Time*: 12 WeeksOMAP3503DCUS
None Reported View Distributors
View all Distributors

** Lead time information is not available at this time. However, our information is updated daily so please check back with us soon. Please contact your preferred TI Authorized Distributor for additional information.

Quality & Lead (Pb)-Free Data

	Product Content				DPPM / MTBF / FIT Rate
Device	Eco Plan*	Lead / Ball Finish	MSL Rating / Peak Reflow	Details	Details
OMAP3503DCBB	Green (RoHS & no Sb/Br)	Call TI	Level-3-260C-168 HR	View	View
OMAP3503DCBBA	Green (RoHS & no Sb/Br)	Call TI	Level-3-260C-168 HR	View	View
OMAP3503DCBC	Green (RoHS & no Sb/Br)	Call TI	Level-3-260C-168 HR	View	View
OMAP3503DCUS	Green (RoHS & no Sb/Br)	Call TI	Level-4-260C-72 HR	View	View

* The planned eco-friendly classification: Pb-Free (RoHS) or Pb-Free (RoHS Exempt) or Green (RoHS & no Sb/Br) - please click on the Product Content Details "View" link in the table above for the latest availability information and additional product content details.

If the information you are requesting is not available online at this time, contact one of our Product Information Centers regarding the availability of this information.

Technical Documents TI Recommends

Most useful technical documents for OMAP3503

Tools & Software

Name	Part #	Company	Tool / Software Type
Code Composer Studio Integrated Development Environment (IDE) - v4.x	CCSTUDIO	Texas Instruments	Code Composer Studio(TM) IDE
e-CAM32_OMAP35x - Camera Module		e-con Systems India Pvt. Ltd.	Daughter Cards
OMAP35x Evaluation Module (EVM)	TMDSEVM3530	Texas Instruments	Development Boards/EVMs
Zoom OMAP35x Medical Development Kit	TMDSMEVM3530-L	Texas Instruments	Development Boards/EVMs
LI-3M02 Camera board for OMAP35x EVM		Leopard Imaging Inc	Development Tools
XDS510 Class Emulators	XDS510	Texas Instruments	Emulators/Analyzers
Linux Digital Video Software Development Kits (DVSDK) for OMAP35x Processors	LINUXDVSDK-OMAP	Texas Instruments	Starter Kits
QNX Neutrino RTOS		QNX Software Systems	Operating Systems (OS/RTOS)
Windows CE BSP for OMAP35x Processors	DVSDK-WINCEOMAP	Texas Instruments	Operating Systems (OS/RTOS)

Simulation Models

BSDL Model
- OMAP3515/03 CBB BSDL Model (Rev. B) (ZIP, 10 KB) 494 views
  11 Feb 2009
- OMAP3515/03 CUS BSDL Model (Rev. A) (ZIP, 9 KB) 309 views
  15 Jan 2009

View Simulation Models for OMAP35x Processors

Part #	Name	Product Family	Comments
OMAP3530	Applications Processor	OMAP™ Applications Processors - OMAP35x PROCESSORS	The device has SIMILAR FUNCTIONALITY but is not functionally equivalent to the compared device.
OMAP3525	Applications Processor	OMAP™ Applications Processors - OMAP35x PROCESSORS	The device has SIMILAR FUNCTIONALITY but is not functionally equivalent to the compared device.
OMAP3515	Applications Processor	OMAP™ Applications Processors - OMAP35x PROCESSORS	The device has SIMILAR FUNCTIONALITY but is not functionally equivalent to the compared device.
SN65LVDS315	CAMERA PARALLEL RGB TO MIPI CSI-1 SERIAL CONVERTER	DISPLAY INTERFACE - FLATLINK (LVDS FOR LCD)
SN65LVDS301	Programmable 27-Bit Display Serial Interface Transmitter	DISPLAY INTERFACE - FLATLINK (LVDS FOR LCD)
TPS62350	1A, 3MHz Buck Converter with I2C for Dynamic Voltage Scaling	DC/DC CONVERTERS (INTEGRATED SWITCH) - STEP-DOWN REGULATORS	Complementary Analog Part
TPS65023	6-channel Power Mgmt IC with 3DC/DCs, 3 LDOs, I2C Interface and DVS, Optimized for DaVinci DSPs	POWER MANAGEMENT MULTI-CHANNEL IC (PMIC) SOLUTIONS - PMIC SOLUTIONS WITH AND WITHOUT BATTERY CHARGER	Complementary Analog Part
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OMAP3530	Applications Processor	OMAP™ Applications Processors-OMAP35x PROCESSORS	TI customers also evaluated this product.
OMAP3525	Applications Processor	OMAP™ Applications Processors-OMAP35x PROCESSORS	TI customers also evaluated this product.
OMAP3515	Applications Processor	OMAP™ Applications Processors-OMAP35x PROCESSORS	TI customers also evaluated this product.
OMAP-L138	Low-Power Applications Processor	OMAP™ Applications Processors-OMAP-Lx Processors	TI customers also evaluated this product.
OMAP-L137	Low-Power Applications Processor	OMAP™ Applications Processors-OMAP-Lx Processors	TI customers also evaluated this product.
TPS65950	Integrated Power Management IC with 3 DC/DC's, 11 LDO's, Audio Codec, USB HS Transceiver, Charger	POWER MANAGEMENT MULTI-CHANNEL IC (PMIC) SOLUTIONS-PMIC SOLUTIONS WITH AND WITHOUT BATTERY CHARGER	TI customers also evaluated this product.
TMS320DM365	Digital Media System-on-Chip (DMSoC)	DAVINCI VIDEO PROCESSORS-TMS320DM3x ARM9™ Based SOCs	TI customers also evaluated this product.
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TMS320DM355	Digital Media System-on-Chip (DMSoC)	DAVINCI VIDEO PROCESSORS-TMS320DM3x ARM9™ Based SOCs	TI customers also evaluated this product.
TMS320VC5505	Low-Power Fixed-Point Digital Signal Processor	TMS320C5000 DSP PLATFORM-TMS320C55X DSP GENERATION	TI customers also evaluated this product.
TMS320DM335	Digital Media System-on-Chip (DMSoC)	DAVINCI VIDEO PROCESSORS-TMS320DM3x ARM9™ Based SOCs	TI customers also evaluated this product.
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All End-Equipment

OMAP3503 Status: ACTIVE

Applications Processor

See Also

Most Popular Links

Datasheet

Functional Block Diagram

Customers Who Evaluated This Product Also Evaluated

Product Information

Features

Description

Pricing / Packaging / CAD Design Tools / Samples

Inventory

Quality & Lead (Pb)-Free Data

Technical Documents TI Recommends

Datasheet

Application Notes

User Guides

White Papers

Errata

More Literature

Tools & Software

Simulation Models

Support and Community

Customer Tags

Other Support

OMAP3503 Status: ACTIVE

Applications Processor

See Also

Most Popular Links

Datasheet

Functional Block Diagram

Customers Who Evaluated This Product Also Evaluated

Product Information

Features

Description

Pricing / Packaging / CAD Design Tools / Samples

Inventory

Quality & Lead (Pb)-Free Data

Technical Documents TI Recommends

Datasheet

Application Notes

User Guides

White Papers

Errata

More Literature

Tools & Software

Simulation Models

Related Products

Related End Equipments

Support and Community

Customer Tags

Other Support