Product details

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Clock frequency (max) (MHz) 25 Supply current (max) (µA) 180000 Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Clock frequency (max) (MHz) 25 Supply current (max) (µA) 180000 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Choice of Operating Speeds
    • High-Speed, A Devices . . . 25 MHz Min
    • Half-Power, A-2 Devices . . . 16 MHz Min
  • Choice of Input/Output Configuration
  • Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
  • DEVICE
    I
    INPUTS
    3-STATE
    O OUTPUTS
    REGISTERED
    Q OUTPUTS
    I/O
    PORT
    S
    PAL16L8
    10
    2
    0
    6
    PAL16R4
    8
    0
    4 (3-state buffers)
    4
    PAL16R6
    8
    0
    6 (3-state buffers)
    2
    PAL16R8
    8
    0
    8 (3-state buffers)
    0

    PAL is a registered trademark of Advanced Micro Devices Inc.

  • Choice of Operating Speeds
    • High-Speed, A Devices . . . 25 MHz Min
    • Half-Power, A-2 Devices . . . 16 MHz Min
  • Choice of Input/Output Configuration
  • Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
  • DEVICE
    I
    INPUTS
    3-STATE
    O OUTPUTS
    REGISTERED
    Q OUTPUTS
    I/O
    PORT
    S
    PAL16L8
    10
    2
    0
    6
    PAL16R4
    8
    0
    4 (3-state buffers)
    4
    PAL16R6
    8
    0
    6 (3-state buffers)
    2
    PAL16R8
    8
    0
    8 (3-state buffers)
    0

    PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.

The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.

The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 2
Type Title Date
* Data sheet Standard High-Speed Programmable Array Logic Circuits datasheet 01 Mar 1992
* SMD PAL16L8AM SMD 81036072A 21 Jun 2016

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
CDIP (J) 20 View options
CFP (W) 20 View options
LCCC (FK) 20 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos