SN74ALVC7804

ACTIVE

Product details

Technology family ALVC Rating Military Operating temperature range (°C) to
Technology family ALVC Rating Military Operating temperature range (°C) to
SSOP (DL) 56 190.647 mm² 18.42 x 10.35
  • Operates at 3-V to 3.6-V VCC
  • Load Clock and Unload Clock Can Be Asynchronous or Coincident
  • Low-Power Advanced CMOS Technology
  • Full, Empty, and Half-Full Flags
  • Programmable Almost-Full/Almost-Empty Flag
  • Fast Access Times of 18 ns With a 50-pF Load and All Data Outputs Switching Simultaneously
  • Data Rates From 0 to 40 MHz
  • 3-State Outputs
  • Pin Compatible With SN74ACT7804
  • Packaged in Shrink Small-Outline 300-mil Package (DL) Using 25-mil Center-to-Center Spacing
  • Operates at 3-V to 3.6-V VCC
  • Load Clock and Unload Clock Can Be Asynchronous or Coincident
  • Low-Power Advanced CMOS Technology
  • Full, Empty, and Half-Full Flags
  • Programmable Almost-Full/Almost-Empty Flag
  • Fast Access Times of 18 ns With a 50-pF Load and All Data Outputs Switching Simultaneously
  • Data Rates From 0 to 40 MHz
  • 3-State Outputs
  • Pin Compatible With SN74ACT7804
  • Packaged in Shrink Small-Outline 300-mil Package (DL) Using 25-mil Center-to-Center Spacing

A FIFO memory is a storage device that allows data to be written into and read from its array at independent data rates. The SN74ALVC7804 is an 18-bit FIFO with high speed and fast access times. Data is processed at rates up to 40 MHz with access times of 18 ns in a bit-parallel format. The SN74ALVC7804 is designed for 3-V to 3.6-V VCC operation.

Data is written into memory on a low-to-high transition of the load clock (LDCK) and is read out on a low-to-high transition of the unload clock (UNCK). The memory is full when the number of words clocked in exceeds the number of words clocked out by 512. When the memory is full, LDCK has no effect on the data residing in memory. When the memory is empty, UNCK has no effect.

Status of the FIFO memory is monitored by the full (), empty (), half-full (HF), and almost- full/almost-empty (AF/AE) flags. The output is low when the memory is full and high when the memory is not full. The output is low when the memory is empty and high when it is not empty. The HF output is high whenever the FIFO contains 256 or more words and is low when it contains 255 or less words. The AF/AE status flag is a programmable flag. The first one or two low-to-high transitions of LDCK after reset are used to program the almost-empty offset value (X) and the almost-full offset value (Y), if program enable () is low. The AF/AE flag is high when the FIFO contains X or less words or (512 minus Y) or more words. The AF/AE flag is low when the FIFO contains between (X plus 1) and (511 minus Y) words.

A low level on the reset () resets the internal stack pointers and sets high, AF/AE high, HF low, and low. The Q outputs are not reset to any specific logic level. The FIFO must be reset upon power up. The first word loaded into empty memory causes to go high and the data to appear on the Q outputs. The data outputs are in the high-impedance state when the output-enable () is high.

A FIFO memory is a storage device that allows data to be written into and read from its array at independent data rates. The SN74ALVC7804 is an 18-bit FIFO with high speed and fast access times. Data is processed at rates up to 40 MHz with access times of 18 ns in a bit-parallel format. The SN74ALVC7804 is designed for 3-V to 3.6-V VCC operation.

Data is written into memory on a low-to-high transition of the load clock (LDCK) and is read out on a low-to-high transition of the unload clock (UNCK). The memory is full when the number of words clocked in exceeds the number of words clocked out by 512. When the memory is full, LDCK has no effect on the data residing in memory. When the memory is empty, UNCK has no effect.

Status of the FIFO memory is monitored by the full (), empty (), half-full (HF), and almost- full/almost-empty (AF/AE) flags. The output is low when the memory is full and high when the memory is not full. The output is low when the memory is empty and high when it is not empty. The HF output is high whenever the FIFO contains 256 or more words and is low when it contains 255 or less words. The AF/AE status flag is a programmable flag. The first one or two low-to-high transitions of LDCK after reset are used to program the almost-empty offset value (X) and the almost-full offset value (Y), if program enable () is low. The AF/AE flag is high when the FIFO contains X or less words or (512 minus Y) or more words. The AF/AE flag is low when the FIFO contains between (X plus 1) and (511 minus Y) words.

A low level on the reset () resets the internal stack pointers and sets high, AF/AE high, HF low, and low. The Q outputs are not reset to any specific logic level. The FIFO must be reset upon power up. The first word loaded into empty memory causes to go high and the data to appear on the Q outputs. The data outputs are in the high-impedance state when the output-enable () is high.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 19
Type Title Date
* Data sheet 512 X 18 First-In, First-Out datasheet 01 Jan 1995
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
User guide ALVC Advanced Low-Voltage CMOS Including SSTL, HSTL, And ALB (Rev. B) 01 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 08 Sep 1999
Application note TI SN74ALVC16835 Component Specification Analysis for PC100 03 Aug 1998
Application note Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A) 13 May 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996
Application note Power-Dissipation Calculations for TI FIFO Products (Rev. A) 01 Mar 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
SSOP (DL) 56 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos