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Quality & Lead (Pb)-Free Data Product Content DPPM / MTBF / FIT Rate Device Eco Plan* Lead / Ball Finish MSL Rating / Peak Reflow Details Details SN74LVC1G06MDCKREP Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM View View V62/06655-01XE Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM View View
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Technical Documents
Most useful technical documents for SN74LVC1G06-EP
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Application Notes
Input and Output Characteristics of Digital Integrated Circuits Read Abstract
Live Insertion Read Abstract
Selecting the Right Texas Instruments Signal Switch Read Abstract
Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices Read Abstract
TI IBIS File Creation, Validation, and Distribution Processes Read Abstract
Use of the CMOS Unbuffered Inverter in Oscillator Circuits Read Abstract
Shelf-Life Evaluation of Lead-Free Component Finishes Read Abstract
Selecting the Right Level Translation Solution (Rev. A) Read Abstract
Understanding and Interpreting Standard-Logic Data Sheets (Rev. B) Read Abstract
Texas Instruments Little Logic Application Report Read Abstract
16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) Read Abstract
Implications of Slow or Floating CMOS Inputs (Rev. C) Read Abstract
Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Read Abstract
Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Read Abstract
CMOS Power Consumption and CPD Calculation (Rev. B) Read Abstract
LVC Characterization Information Read Abstract
Understanding Advanced Bus-Interface Products Design Guide
User Guides
Selection Guides
Solution Guides
More Literature
Logic Cross-Reference (Rev. A) Dual-Supply Level Translation Product Clip (Rev. B) Design Summary for WCSP Little Logic (Rev. B) SN74LVC1G97 and SN74LVC1G98 Product Clip (Rev. A) Military Low Voltage Solutions SN74LVC1G3157 and SNS74LVC2G53 SPDT Analog Switches Standard Linear & Logic for PCs, Servers & Motherboards STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Low-Voltage Logic (LVC) Designer's Guide Read Abstract
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