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TI380C30A Status: OBSOLETE

TI380C30A integrated token-ring commprocessor and physical-layer interface


      
         
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Product Information

Features

  • Single-Chip Token-Ring Solution
  • IBMTM Token-Ring NetworkTM Compatible
  • Compatible With ISO/IEC IEEE Std 802.5:1992 Token-Ring Access-Method and Physical-Layer Specifications
  • Compatible With TI380FPA PacketBlasterTM
  • Glueless Memory Interface
  • Digital Phase-Locked Loop (PLL)
    • Precise Control of Bandwidths
    • Improved Jitter Tolerance
    • Minimizes Accumulated Phase Slope
  • Phantom Drive for Physical Insertion Onto Ring
  • Differential Line Receiver With Level-Dependent Frequency Equalization
  • Low-Impedance Differential Line Driver to Ease Transmit-Filter Design
  • On-Chip Watchdog Timer
  • Internal Crystal Oscillator for Reference-Clock Generation
  • Expandable LAN-Subsystem Memory up to 2M Bytes
  • 32-Bit Host Address Bus
  • 80x8x or 68xxx-Type Bus and Memory Organization
  • Dual-Port Direct Memory Access (DMA) and Direct Input/Output Transfers to Host Bus
  • Supports 8- or 16-Bit Pseudo-Direct Memory Access (PDMA) Operation
  • Electrostatic Discharge (ESD) Protection Exceeds 2 kV (All Pins)

View All Features in Datasheet

Description

The TI380C30A is a single-chip token-ring solution, combining the commprocessor and the physical-layer (PHY) interface onto a single device. The TI380C30A supports 16 Mbit/s and 4 Mbit/s of operation, conforms to ISO 8802-5/IEEE Std 802.5-1992 standards, and has been verified to be completely IBM Token-Ring Network compatible.

The TI380C30A provides a high degree of integration as it combines the functions of the TI380C25 and the TI380C60A onto a single chip. Additional information on the PHY section can be found in the TI380C60A data sheet, literature number SPWS033. With the TI380C30A, only local memory and minimal additional components such as PAL® devices and crystal oscillators need to be added to complete the LAN-subsystem design.

View All Description in Datasheet

    

Pricing / Packaging / CAD Design Tools / Samples

PackagingSamples
DeviceStatusTemp (oC)Package | PinsSamples
TI380C30APGFOBSOLETE0 to 0LQFP (PGF) | 176 Not Available

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