Product details

Output power (W) 0.075 Analog supply (min) (V) 4.5 Analog supply voltage (max) (V) 5.5 Load (min) (Ω) 32 PSRR (dB) 81 Rating Catalog Operating temperature range (°C) -40 to 85 Headphone channels Stereo Volume control No Architecture Class-AB Iq per channel (typ) (mA) 2.8
Output power (W) 0.075 Analog supply (min) (V) 4.5 Analog supply voltage (max) (V) 5.5 Load (min) (Ω) 32 PSRR (dB) 81 Rating Catalog Operating temperature range (°C) -40 to 85 Headphone channels Stereo Volume control No Architecture Class-AB Iq per channel (typ) (mA) 2.8
SOIC (D) 8 29.4 mm² 4.9 x 6
  • High-Fidelity Line-Out/HP Driver
  • 75-mW Stereo Output
  • PC Power Supply Compatible
  • Pop Reduction Circuitry
  • Internal Mid-Rail Generation
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
  • Pin Compatible With TPA302
  • High-Fidelity Line-Out/HP Driver
  • 75-mW Stereo Output
  • PC Power Supply Compatible
  • Pop Reduction Circuitry
  • Internal Mid-Rail Generation
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
  • Pin Compatible With TPA302

The TPA152 is a stereo audio power amplifier capable of less than 0.1% THD+N at 1 kHz when delivering 75 mW per channel into a 32- loads, the THD+N performance is better than 0.005% at 1 kHz, and less than 0.01% across the audio band of 20 to 20 kHz.

The TPA152 is ideal for use as an output buffer for the audio CODEC in PC systems. It is also excellent for use where a high-performance head phone/line-out amplifier is needed. Depop circuitry is integrated to reduce transients during power up, power down, and mute mode.

Amplifier gain is externally configured by means of two resistors per input channel and does not require external compensation for settings of 1 to 10. The TPA152 is packaged in the 8-pin SOIC (D) package that reduces board space and facilitates automated assembly.

The TPA152 is a stereo audio power amplifier capable of less than 0.1% THD+N at 1 kHz when delivering 75 mW per channel into a 32- loads, the THD+N performance is better than 0.005% at 1 kHz, and less than 0.01% across the audio band of 20 to 20 kHz.

The TPA152 is ideal for use as an output buffer for the audio CODEC in PC systems. It is also excellent for use where a high-performance head phone/line-out amplifier is needed. Depop circuitry is integrated to reduce transients during power up, power down, and mute mode.

Amplifier gain is externally configured by means of two resistors per input channel and does not require external compensation for settings of 1 to 10. The TPA152 is packaged in the 8-pin SOIC (D) package that reduces board space and facilitates automated assembly.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Same functionality with different pin-out to the compared device
TPA4411 ACTIVE 80-mW, stereo, analog input headphone amplifier Wider supply voltage range

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 4
Type Title Date
* Data sheet 75-mW Stereo Audio Power Amplifier datasheet (Rev. A) 15 Mar 2000
Application note Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 26 Aug 2019
Application note AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 27 Jun 2019
User guide TPA152EVM - User Guide 14 Apr 1998

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins Download
SOIC (D) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos