UCC27322 Status: ACTIVE

Product Information

Features

• Industry-Standard Pin-Out Addition of Enable Funtion
• High-Peak Current Drive Capability of ±9 A at the Miller Plateau Region Using TrueDrive
• Efficient Constant Current Sourcing Using a Unique BiPolar & CMOS Output Stage
• TTL/CMOS Compatible Inputs Independent of Supply Voltage
• 20-ns Typical Rise and Fall Times with 10-nF Load
• Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns with Input Rising
• 4-V to 15-V Supply Voltage
• Available in Thermally Enhanced MSOP PowerPAD™ Package With 4.7°C/W jc
• Rated From –40°C to 105°C
• Pb-Free Finish (NiPdAU) on SOIC-8 and PDIP-8 Packages
• APPLICATIONS
  • Switch Mode Power Supplies
  • DC/DC Converters
  • Motor Controllers
  • Class-D Switching Amplifiers
  • Line Drivers
  • Pulse Transformer Driver

PowerPAD is trademarks of Texas Instruments Incorporated.

Description

The UCC37321/2 family of high-speed drivers deliver 9 A of peak drive current in an industry standard pinout. These drivers can drive the largest of MOSFETs for systems requiring extreme Miller current due to high dV/dt transitions. This eliminates additional external circuits and can replace multiple components to reduce space, design complexity and assembly cost. Two standard logic options are offered, inverting (UCC37321) and noninverting (UCC37322).

Using a design that inherently minimizes shoot-through current, the outputs of these can provide high gate drive current where it is most needed at the Miller plateau region during the MOSFET switching transition. A unique hybrid output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at low supply voltages. With this drive architecture, UCC37321/2/3 can be used in industry standard 6-A, 9-A and many 12-A driver applications. Latch up and ESD protection circuitries are also included. Finally, the UCC37321/2 provides an enable (ENBL) function to have better control of the operation of the driver applications. ENBL is implemented on pin 3 which was previously left unused in the industry standard pin-out. It is internally pulled up to Vdd for active high logic and can be left open for standard operation.

In addition to SOIC-8 (D) and PDIP-8 (P) package offerings, the UCC37321/2 also comes in the thermally enhanced but tiny 8-pin MSOP PowerPAD™ (DGN) package. The PowerPAD™ package drastically lowers the thermal resistance to extend the temperature operation range and improve the long-term reliability.