SLLSEB1F
February 2012 – October 2021
TPD1E10B06
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings—JEDEC Specification
6.3
ESD Ratings—IEC Specification
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Receiving Notification of Documentation Updates
11.2
Support Resources
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DPY|2
MPSS034C
DYA|2
MPSS124A
Thermal pad, mechanical data (Package|Pins)
DPY|2
QFND429B
Orderable Information
sllseb1f_oa
sllseb1f_pm
1
Features
Provides system-level ESD protection for low-voltage I/O interface
IEC 61000-4-2 level 4 ESD protection
±30 kV contact discharge
±30 kV air-gap discharge
IEC 61000-4-5 surge: 6 A (8/20 µs)
I/O capacitance 12 pF (typical)
R
DYN
0.4 Ω (typical)
DC breakdown voltage ±6 V (minimum)
Ultralow leakage current 100 nA (maximum)
10-V clamping voltage (maximum at I
PP
= 1 A)
Industrial temperature range: –40°C to 125°C
Small 0402 footprint
(1 mm × 0.6 mm × 0.5 mm)
Industry standard SOD-523 package
(0.8 mm × 1.2 mm)