Windows Embedded CE | TI Application support for WinCE

Windows Embedded CE

Windows Embedded CE is a componentized, real-time operating system for a wide range of small footprint devices. Developers use Windows Embedded CE for a variety of smart, connected, and service-oriented devices, ranging from power-conscious GPS handhelds to real-time, mission-critical industrial controllers. TI offers a WinCE DVSDK today for OMAP35x and DM644x processors.

OMAP35x support is available on Windows Embedded CE 6.0, along with Platform Builder, a Visual Studio 2005 plug in. Platform Builder provides an integrated development environment (IDE) that enables you to build both application and Windows Embedded CE 6.0 operating system software in a familiar environment while improving existing or creating new embedded devices.

• Unified Kernel
  The Windows Embedded CE 6.0 kernel handles more than 32,000 simultaneous processes, each with 2GB of virtual memory space. The file system supports larger storage media and file sizes (up to 4 GB) and removable media encryption.
• Drivers
  Production-quality device drivers help decrease the amount of modification needed for drivers to work with custom hardware. Enhanced driver support helps ensure easy portability. Drivers can be run in kernel mode for top performance or in user mode for additional robustness.
• Security Features
  The redesigned, one-tier security model feature is SDL compliant and helps ensure that only authenticated applications can run on an embedded device.
• Device Performance
  Improvements to the kernel architecture reduce the overhead of system calls between base OS services, improving operating system performance.
• Connectivity
  Windows Embedded CE 6.0 R2 extends the capabilities of existing CE devices to connect to Windows Servers and to each other, allowing you to quickly develop low footprint device scenarios that connect to Windows PCs and Servers.

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TI Application support for WinCE

OMAP35x WinCE Demo - features

OMAP35x EVM developers can demo the WinCE BSP today on their existing EVM hardware. The WinCE DEMO includes a comprehensive Welcome Tour based on Adobe Flash that demonstrates the key features of the BSP, shows off the compelling graphics & video demos and introduces other OMAP™ 3 product offerings like DVT, SDIO HX and Wireless DevKit.

WinCE Pro 6.0 contains key applications and services such as SQL/Everywhere, XML Web Services, Web Browsing, Windows Media Playback with DRM, Networking and Web Services. This demo has all of the system and peripheral drivers built-in such as OEM Abstraction Layer (OAL), Audio USB2.0 Host and OTG, SDIO, Keypad, DMA Power Management Framework, LCD, S-Video and DVI support with screen rotation.

Evaluate the built-in superior video and audio capabilities using the Codec Engine inter-processor communication using DSPLink as well as the DirectShow Filters. A number of support files are included such as MP3, WMA9, AAC, H.264, MPEG2 and MPEG4.

Learn more about the Demo or request access.

WinCE DVSDK for OMAP35x – features and download

When OMAP35x EVM users are ready to begin development, the WinCE DVSDK includes a Visual Studio tools plug-in (allowing developers to build an image with WinCE R2 6.0 Pro containing key applications and services such as SQL/Everywhere, XML Web Services, Web Browsing, Windows Media Playback with DRM, Networking and Web Services). The DVSDK also contains system drivers such as Bootloader (Eboot) including boot support from SD Card, USB and Ethernet, OEM Abstraction Layer (OAL), Power Management Framework, LCD and DVI with screen rotation support Video out and Audio In/Out, as well as peripheral drivers such as USB2.0 Host and OTG, SDIO Card, Keypad, DMA. TI’s Codec Engine inter-processor support using DSPLink is included as well as DirectShow Filters for accelerated codec support including MP3, WMA9 and AAC decode audio codec, JPEG encode/decode imaging codec and H.264, MPEG2 and MPEG4 encode/decode codec. The DVSDK will include accelerated 3D graphics with OpenGL ES1.1, Open GL ES2.0 and OpenVG 1.0.1/1.1 supported using POWERVR SGX™.

Learn more about the DVSDK or request access.

DM644x WinCE BSP

Based on WinCE 5.0, the DM644x Board Support Package includes IPC, Usage examples and documentation. Support and customization packages are available from TI’s Authorized Software Partners (ASP). Get started by requesting the SDK or contacting your local ASP or Windows CE provider.

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