Low-Power RF eNewsletter November 2010
Texas Instruments
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Welcome to the Low-Power RF eNewsletter from TI.

In this issue:
Hardware & Software
Technical Documents
Developer’s News
Free Webinars
Other News
Events
Featured video
Stellaris ZigBee® Networking Kit
Merging the performance and ease-of-use of Stellaris® ARM® Cortex™-M3-based microcontrollers (MCU) with leading wireless connectivity solutions, TI extends its portfolio with the new Stellaris ZigBee Networking Kit (DK-EM2-2520Z).

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Hardware & Software
New Z-Stack Release

The Z-Stack 2.3.1 includes serial boot loader support and ZigBee network processor support for CC2530. It also incorporates the results of extensive stress testing in large network settings. Our 400 node in-house test system has been used to tune in unprecedented stability and efficiency in the routing algorithm.

Download at www.ti.com/z-stack
 
Stellaris® development kits for Wireless Networking Applications
Stellaris® development kits Merging the performance and ease-of-use of Stellaris® ARM® Cortex™-M3-based microcontrollers (MCU) with leading wireless connectivity solutions, TI has launched three new wireless kits. The kits serve as modular extensions to TI’s Stellaris DK-LM3S9B96 development kit to give engineers complete software and reference design solutions for adding RFID, low-power RF and ZigBee® capabilities to designs.
For more information, go to www.ti.com/stellariswireless.
Technical Documents
DN033 Mitsubishi Ceramic Antenna for 868 MHz, 915 MHz & 955 MHz

This design note describes a Mitsubishi antenna design that can be used with all Sub 1GHz transceivers and transmitters from TI.

More
 
DN034 2.4 GHz Yagi PCB Directional Antenna

The antenna described in this design note is a Yagi directional antenna with approximately 7dBi gain and high efficiency. Impedance of the antenna input is 50 Ω which allows for easy matching. Application environments such as corridor coverage, metering surveillance, and maximum range distance between two fixed devices can be ideal applications for the directional type of antennas since the antenna gain can be utilized to achieve a greater range distance between two devices.

More
Update to CC1110EM 315, 433, and 868/915 MHz reference designs

Crystal size is changed to 3.2 x 2.5 mm. No changes to performance.

MHz 868-915
MHz 433
MHz 315
New TI Smart Metering selection guide
Download your key to smart meter solutions
Learn more about TI Smart Metering Solutions at www.ti.com/metering
Developer’s News
Anaren Joins Forces with Arrow Electronics to Launch AIR Modules Line

New family of FCC-approved Anaren Integrated Radio (AIR) modules – incorporating Texas Instruments low-power RF technology – is first-ever product line stocked with the Denver, CO-based distributor.

More
 
LS Industrial Systems (LSIS) release their third Zigbee® Smart Energy certified product, based on TI’s CC2530 system-on-chip ZigBee solution.

LSMKE-ZBSE is an Energy Service Portal (ESP) that functions as a protocol converter and a wired-to-wireless home gateway. This gateway converts a serial (RS485)/ proprietary protocol to Zigbee Smart Energy. LSIS has recently implemented its complete metering system solution for more than 10k apartment homes, using certified products based on TI’s CC2530 ZigBee radio chip and CC2591, a 2.4 GHz RF Front End for low-power wireless applications.

More
A newly certified In-Home Display for ZigBee® Smart Energy by LS Industrial Systems

In-Home Display for ZigBee® Smart Energy by LS Industrial Systems LSMKE-D1, designed by LS Industrial Systems, is a multi-purpose IHD(In-Home Display) that displays energy consumption data in numeric and graph-view, group-average consumption for comparison, and CO2 emission to encourage energy saving. It also predicts monthly bills based on consumption patterns. Other capabilities include price table display, local weather update, energy saving tips, MP3 player, and digital photo album. It is a clear-type, touch screen, 7" display that can be stand-alone or wall-mounted. LSMKE-D1 uses Texas Instruments’ CC2530 system-on-chip ZigBee solution with CC2591, a 2.4 GHz RF Front End for low-power wireless applications.

More
Free Webinars
Thursday, Dec. 2, 2010: BLE, ZigBee® + Wi-Fi technologies enable connected, personal healthcare

BLE, ZigBee® + Wi-Fi technologies Free webinarThis webinar will bring together industry experts from In-Stat, TI, the Continua Health Alliance and Intuitive Health to examine how BLE, ZigBee and Wi-Fi technologies are working together to transform the personal healthcare industry and spur new use cases outside of the mobile realm.

Wednesday, Dec. 8, 2010: Telehealth Aggregation Managers – Choosing the right semiconductor solutions and wireless technologies for your personal connected health system

The Telehealth Aggregation Manager (AM) is an essential device in the connected health system enabling personal health devices to log data in a remote Electronic Health Record (EHR) for family and clinical review. Choosing the right semiconductor solutions and wireless technologies simplifies design, addresses interoperability concerns and shortens time-to-market.

This webinar will address how advances in semiconductor technology including embedded processing, power management and wireless connectivity can help you accelerate your telehealth aggregation manager system design and which tools are available to facilitate your design process.

Other News
TI upgrades its commitment to EnOcean Alliance for energy-efficient buildings
EnOcean AllianceTI has become a promoter of the EnOcean Alliance, of which it has been a member since 2008. By upgrading to promoter status, TI is reinforcing its commitment to EnOcean’s energy harvesting wireless technology and will provide its expertise in energy-efficient integrated circuits (ICs). The EnOcean Alliance, founded in 2008, is driven to establish EnOcean as an international standard for sustainable buildings. The alliance counts more than 160 members worldwide, including leading companies from the building technology and electronics sectors.
More
Events
December 9th: Experience TI’s eTech Day from the comfort of your own desk!
On December 9th, attend virtual live and on-demand training aimed at providing a learning forum for design engineers where practical high-performance solutions and tools are presented for analog and digital technologies. Chat with TI subject matter experts who will be available on the TI E2E™ Community.
Register Now!
Meet the TI Low-Power RF team at CES 2011

CES 2011 is only a few weeks away and the Low-Power RF team has several good reasons for you to start planning your CES 2011 visit. We’ll be showcasing our latest developments in wireless audio, Bluetooth® low energy, ANT™, ZigBee®, RF4CE and more. Be sure to watch this space for more information on our activities at CES.

 
Meet TI at the Digital Health Summit @ CES 2011

Join TI and other industry experts in discussions around the rapidly evolving industry of digital health technologies. The Summit is presented on Friday, January 7, 2011 and is located at the Las Vegas Convention Center (LVCC), North Hall, N253.

www.digitalhealthsummit.com
 
Award Ceremony – Bluetooth Innovation World Cup 2010

An international panel of Bluetooth technology experts has selected nine finalists in the 2010 Bluetooth Innovation World Cup. The winner of the international Bluetooth innovation competition will be presented at the official award ceremony, taking place at the ispo sporting goods conference, February 6-9 in Munich, Germany. The Innovator of the Year 2010 will receive a prize worth $50,000 USD. Texas Instruments is an official partner of the Bluetooth Innovation World Cup.

More
 
Mobile World Congress 2011

Visit TI at stand 8A84, Hall 8 at the Mobile World Congress 2011, February 14-17 in Barcelona, Spain. Watch this space for more information in the coming issues of the LPRF eNewsletter.

 
Texas Instruments Technology Days 2010 – Join us for a day packed with technical design seminars and technology exhibits
Texas Instruments Technology Days 2010 The IC training is aimed at providing a learning forum for design engineers where practical high-performance solutions, tools and workshops are presented for analog and digital technologies. The exhibits demonstrate the latest TI technology. Don’t miss this opportunity to meet with a number of Texas Instruments’ experts and gain valuable ideas for solving your technical challenges!

Coming up next

Americas: Austin, November 30, Buenos Aires (date TBD)
Europe: Bochum, Germany December 1

Visit www.ti.com/techdays for a complete list of our Technology Days worldwide.
Archived newsletters

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