| Low-Power RF & Wireless Connectivity |
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| eNewsletter |
May 2011 |
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Dear %%FIRST_NAME%% %%LAST_NAME%%
Welcome to the Low-Power RF and Wireless Connectivity eNewsletter from TI –
the newsletter that keeps you up to date on new software and hardware releases, developer’s news, and other news and events associated with TI’s radio frequency and wireless connectivity solutions.
In this issue:
| Hardware & Software |
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| Technical Documents |
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| Developer’s News |
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Other News
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| Events |
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Featured Video:
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| E2E online community - what are engineers discussing right now? |
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| Hardware & Software |
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| Secure your PurePath™ Wireless Audio Headset Development Kit now for USD $99 |
 Start your wireless headset design with the CC85XXDK-HEADSET development kit. Based on PurePath™ Wireless audio technology and the CC8520 2.4 GHz system-on-chip, the solution transmits uncompressed CD-quality wireless audio over a rock solid RF link, with no unwanted noise or dropouts. Additionally, the kit comes with a free reference design for wireless headsets which provides you with a cost optimized design for high quality products. Order TI’s new headset development kit now for USD $99 only, using the discount code KS9U-BV3P. The offer is valid until June 30th 2011. |
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Order now |
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| ANT™ + Bluetooth® Health and Fitness Aggregator Kit |
 The CC2567 is the first wireless, single-chip solution with dual-mode ANT and Bluetooth connectivity. The Bluetooth software stack from MindTree, serial port profile (SPP) and ANT+ solution runs seamlessly on the mixed signal microcontroller MSP430BT5190 in the simple to use Health and Fitness Aggregator development kit. The solution wirelessly connects 13 million ANT-based devices to the more than 3 billion Bluetooth endpoint devices used by people every day, creating new market opportunities for companies building ANT products and Bluetooth products alike. |
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Order now |
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| Save power and extend application run time with TI’s new DC-DC companion solution |
 The TPS62730 combines a step-down converter for high efficient voltage conversion and an integrated bypass switch. It is optimized for ultra low-power wireless applications such as TI’s low-power wireless sub-1 GHz and 2.4 GHz RF transceivers. When adding TPS62730 between battery and load it reduces current drawn from the battery by up to 30% while not compromising on transmission power or adding disturbance to the signal. The TPS62730 includes TI’s new DCS-Control™ topology, an advanced architecture that provides excellent low output voltage ripple which makes this part ideal for RF applications. |
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Read more |
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| Technical Documents |
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| AN098 – Layout Review Techniques for Low Power RF Designs |
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This application note provides guidelines to successfully copy TI CCxxxx LPRF reference designs and illustrates important RF PCB design concepts for a successful RF PCB layout. It provides steps to lay out an RF PCB and review the final design before sending to the manufacturer. The note also discusses commonly-made PCB design mistakes that will provide designers a clear understanding of things not to do.
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| DN304 Cebal – CCxxxx Development Tools USB Driver Installation Guide |
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The latest LPRF Development Tools USB driver, Cebal, supports both Windows x86 and x64 platforms. This design note describes step by step how to install, update or roll back the driver under Windows XP, Windows Vista and Windows 7.
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| CC1101+CC1190 600 kbps Data Rate, +19 dBm Transmit Power without FHSS in 902-928 MHz Frequency Band |
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By using the CC1190 range extender, the CC1101 transceiver can be set up with 4-FSK modulation. This digital modulation technique allows the combined CC1101 and CC1190 solution to comply with section 15.247 requirements with a +19 dBm (79 mW) transmit output power without the need for frequency hopping. The sensitivity is -95 dBm and the link budget, assuming 0 dB antenna gain, is up to 114 dB when operating the CC1101+CC1190 design at 600 kbps, 4-FSK.
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| Developer’s News |
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| BlueRadios® and Stonestreet One Deliver Bluetooth® 4.0 Dual Mode Low Energy Module |
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The module utilizes the TI CC2564 base band chip, integrating antenna, radio, MSP430 microcontroller, and fully integrated Bluetopia® software stack into an 11.8x17.6x1.9mm package. In addition, BlueRadios is introducing a pin-for-pin compatible n™ BR-LE4.0-S2A single mode nano ampere network module with the TI CC2540 system-on-chip. Both modules are fully compliant with FCC and CE EMC requirements.
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See BlueRadios Bluetooth low energy sensor video demonstration |
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| AMBER wireless offers a new radio-module AMB8520 with TI’s CC430 and integrated ceramic antenna |
 The AMB8520 is a compact and low-cost radio module for wireless half-duplex communication. The standard version of the CE-certified RF module operates in the 868 MHz frequency band, and it is also available without integrated antenna for the frequency range of 433 and 915 MHz. The AMB8520 can be used with the standard protocol of AMBER as well as TI’s SimpliciTI™ protocol stack. Its compact dimensions and low power consumption features make this radio module an ideal solution for battery-powered devices for data collection, monitoring, remote control and sensor networks.
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| Other News |
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| Boldly going where no microcontroller has gone before! |
 MSP430™ microcontrollers featuring FRAM is now available, only from TI.
TI introduces the industry’s first ultra-low power FRAM microcontroller, featuring unified memory with dynamic partitioning and memory access speeds 100 times faster than Flash. By designing your battery-powered wireless sensors using FRAM, you can increase the battery life of your application while significantly reducing field maintenance cost and effort. FRAM delivers the performance you need while using about 50% less power in active mode than most low power microcontrollers in the industry.
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| Events |
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| Mouser and Global Spec Events present Newest Products & Advanced Technologies |
On June 22, 2011 – 10:30 AM – 5:30 PM EDT (7:30 AM – 2:30 PM PDT in North America, Mouser Electronics, Inc. will present Newest Products & Advanced Technologies, an exciting online event for design engineers. Tune in to stay current with the technology trends impacting the engineering marketplace. Participation is free, and one lucky participant will win an iPad 2. Sign up today. The future is here.
Be sure to join the session on:
- Smarter Grid Solutions for Grid Infrastructure, Utility Meters, and Home Automation Systems – Sponsored by Texas Instruments
12:00 PM - 1:00 PM EDT (9:00 AM - 10:00 AM PDT)
As an overview, this session addresses design and development solutions that are consistently present across the smart grid applications spectrum at every stage of the design process. From designing with the right devices and software, to using the right tools and systems support, learn more about state of the art systems design that will benefit you today, and in the future.
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Register Now! |
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| Bluetooth® Information Day, London, June 9th 2011 |
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The Bluetooth SIG invites you to take part in the Bluetooth Information Day 2011 in London on June 9th. At this half-day event, industry representatives provide insight to future applications and business opportunities within Bluetooth low energy. Participation is free of charge.
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Register here! |
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| Texas Instruments Technology Days 2011 – Join us for a day packed with technical design seminars and technology exhibits |
The IC training is aimed at providing a learning forum for design engineers where practical high-performance solutions, tools and workshops are presented for analog and digital technologies. The exhibits demonstrate the latest TI technology. Don’t miss this opportunity to meet with a number of Texas Instruments’ experts and gain valuable ideas for solving your technical challenges! |
Coming up next
Americas: Huntsville June 2, Atlanta June 9, Mexico City June 16, Austin Texas August 18, Vancouver Canada August 25
Europe: Stuttgart, Germany, September 19
Asia: Seoul June 14, Taipei June 16, Beijing September 20, Shanghai September 22, Shenzhen September 27 |
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Visit www.ti.com/techdays for a complete list of our Technology Days worldwide. |
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