| Low-Power RF & Wireless Connectivity |
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| eNewsletter |
June/July 2011 |
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Dear %%FIRST_NAME%% %%LAST_NAME%%
Welcome to the Low-Power RF and Wireless Connectivity eNewsletter from TI –
the newsletter that keeps you up to date on new software and hardware releases, developer’s news, and other news and events associated with TI’s radio frequency and wireless connectivity solutions.
In this issue:
| Hardware & Software |
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| Developer’s News |
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Other News |
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| Events |
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Featured Videos:
PurePath™ Wireless audio headset development kit
View a quick introduction of TI’s PurePath™ Wireless headset development kit. The kit comes with a free reference design. As the market’s most cost-effective design for high quality headsets and headphones, it achieves 22 hours on a 465mAh battery - a 100 percent increase as compared to currently available headsets. |
TRF796x 13.56 MHz Reader
This video provides an overview of the TRF796x series 13.56 MHz RFID Reader IC. The multi-protocol reader IC offers integrated features and flexibility to allow for optimized product design. |
| E2E online community - what are engineers discussing right now? |
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| Hardware & Software |
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| New ZigBee® RF4CE STB front panel reference design with touch sensing support |
 The RF4CE front panel is a low-cost reference design for adding RF connectivity to set-top boxes and TV applications. With TVs and set-top boxes offering more services and enhanced user experience, more advanced remote controls are required. To support these applications TI’s ZigBee RF4CE front panel reference design includes a CC2531 cost-efficient RF4CE radio system-on-chip, IR receiver, and capacitive touch sense buttons.
For more information see the new Capacitive Touch Sensing application note. For samples of the reference design and access to the RF4CE sample application source code, please contact us at rf4ce@ti.com. |
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| Easily add Wi-Fi™ and Bluetooth® technology to your MPU designs |
 Easily add Wi-Fi™ and Bluetooth® technologies to your microprocessor design with the AM18x Sitara™ ARM® evaluation module, now bundled with the WiLink™ 6.0 (WL1271) combo connectivity solution and OpenLink™ open source drivers. The solution targets industrial automation, point of service, portable data terminal, home automation and home energy monitors. |
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Watch the video |
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Order now |
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| New TRF7960A RFID Reader/Writer IC brings enhanced functionality |
This high performance 13.56MHz Multi-Protocol RFID Reader/Writer IC, with an integrated analog front end (AFE) and built in data-framing system for ISO15693, ISO14443A/B and FeliCa supports data rates up to 848kbits. With an enhanced ISO14443A decoder and additional register settings, the TRF7960A allows direct access to all control registers for fine tuning of reader parameters for the highest performance, and makes every application design easy.
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| The right wireless connectivity solution |
Whatever type of wireless connectivity you need for your next designs, TI can help you find the right one.
Check out TI’s new Wireless Connectivity web pages and view the industry’s broadest wireless connectivity portfolio.
www.ti.com/wirelessconnectivity
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| Sneak Peek: TI’s new Sub-1 GHz Value Line. Available in July. |
 The new Sub-1GHz Value Line family offers developers low-cost connectivity solutions for sub-1 GHz RF applications such as remote controls, toys, home and building automation, and security systems. The CC110L transceiver, CC113L receiver and CC115L transmitter devices are all based on TI’s Sub-1 GHz CC1101 RF technology, and are pin-, register- and code-compatible, as well as backwards compatible with existing sub-1 GHz systems. In high volume, the Value Line offers a two-chip, one-way RF link for less than USD $1.00. The CC11xLDK-868-915 and CC11xLEMK-433 development kits provide complete hardware performance testing and software development platforms for the Value Line. The kits also offer new low-cost reference designs, with a compact PCB antenna for 433, 868, 915 MHz, featuring a reduced component count and complete design ready for FCC and ETSI certification.
The Value Line will be available in July 2011.
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| Developer’s News |
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The Bluetooth Innovation World Cup 2011 kicked off on May 1st and more than 100 participants have already entered the competition to claim the Innovator of the Year 2011 title, along with USD $5,000 and a Bluetooth Qualification Program. The twenty free TI kits and more went out on the first day, but there is still time to join and get a 50% discount on TI’s CC2540 Bluetooth low energy development kit. Have you got what it takes? Find out on 
Sustainability, social responsibility, philanthropy, stewardship – there are a lot of words that can describe how Texas Instruments is working to build a better future. We simply call it corporate citizenship. Corporate citizenship is our commitment to be accountable for the company’s social, environmental and economic global impact. See a comprehensive overview of TI’s social and environmental activities and performance in TI's fifth annual Corporate Citizenship Report.
