Low-Power RF & Wireless Connectivity
eNewsletter August 2011
Texas Instruments
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Welcome to the Low-Power RF and Wireless Connectivity eNewsletter from TI – the newsletter that keeps you up to date on new software and hardware releases, developer’s news, and other news and events associated with TI’s radio frequency and wireless connectivity solutions.


In this issue:
Hardware & Software
Tools
Technical Documents

Other News

Events
Featured Video:

Featured Video: CC2570 ANT™ Network Processor Development Kit
Stellaris® 2.4 GHz CC2560 Bluetooth® Wireless Kit
Stellaris® 2.4 GHz CC2560 Bluetooth® Wireless Kit (DK-EM2-2560B) is aimed at jumpstarting Bluetooth®-enabled designs. The performance and integration of Stellaris MCUs pair with TI’s leading Bluetooth solution to help developers address the demand for more streaming audio, remote control and data transfer in industrial and consumer applications.

Featured Video: CC2570 ANT™ Network Processor Development Kit
ZigBee® IP and Smart Energy Profile 2.0 for the Smart Home
Demonstrating ZigBee IP and Smart Energy Profile 2.0 for home automation and smart grid solutions

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Hardware & Software
TI launches 10 Bluetooth® low energy technology profiles
TI recently launched ten Bluetooth® low energy technology (Bluetooth v4.0) profiles with associated sample applications to boost market development of Bluetooth low energy-compliant sensor devices. The Bluetooth low energy application software is a part of TI’s BLE-Stack, and is available royalty-free to all using TI’s CC2540 Bluetooth low energy system-on-chip. TI has achieved Bluetooth Special Interest Group (SIG) certification for find-me, health thermometer, heart rate, and proximity profiles. The updated BLE-Stack also includes support for to-be-adopted profiles such as blood pressure sensor, remote control (soft command), watch (time/network availability), emulated keyboard/dongle (HID), and time and alert notification profiles.
Read the full news release here
Visit www.ti.com/bluetoothlowenergy for more information
New low cost sub-1 GHz value line device family
Low cost Sub-1 GHz value line device family The sub-1GHz value line family offers developers low-cost connectivity solutions for sub-1 GHz RF applications such as remote controls, toys, home and building automation, and security systems. The CC110L transceiver, CC113L receiver and CC115L transmitter devices are all based on TI’s sub-1GHz CC1101 RF technology, and are pin-, register- and code-compatible, as well as backwards compatible with existing sub-1 GHz systems. In high volume, the value line offers a two-chip, one-way RF link for less than USD $1.00.
Order your value line development kit on www.ti.com/rfvalueline
Z-Stack™ 2.5.0 with certified ZigBee® Alliance’s Smart Energy™ 1.1 profile implementation
TI’s new Z-Stack™ 2.5.0 is now available with support for ZigBee Smart Energy 1.1. Geared towards home area networks (HAN), TI’s ZigBee Smart Energy 1.1 profile gives developers the means necessary to interoperate with various implementations of low-power wireless applications such as industrial monitoring and control, smart metering, building automation and more. TI’s Z-Stack 2.5.0 with ZigBee Smart Energy 1.1 is available royalty-free to all using TI’s ZigBee-compliant hardware platforms.
For more information, visit www.ti.com/zigbee
Introducing the industry’s lowest power NFC device
Ideal for infrastructure devices, the new TRF7970A Multi-Protocol Fully Integrated 13.56-MHz RFID/NFC Transceiver IC extends battery life up to two times longer than competitive products, as it provides eight selectable power modes ranging from <1 µA in power-down mode to 120 mA in full-power mode. The transceiver comes with easy-to-configure software to help developers get started quickly.
More
Watch the video
Tools
Stellaris® 2.4GHz Bluetooth® Wireless Kit
Stellaris® 2.4GHz Bluetooth® Wireless Kit The Stellaris® 2.4Ghz CC2560 Bluetooth® Wireless Kit from TI provides a robust, high-throughput wireless connection with extended range and power efficiency. The solution combines TI’s most popular Stellaris microcontroller development kit (sold separately), a Stellaris EM2 expansion board, and TI’s proven 7th generation Bluetooth technology with a complete, validated, certified and production-ready CC2560-PAN1323ETU (Easy-to-Use) board. Paired with the DK-LM3S9B96, the DK-EM2-2560B kit provides the full suite of tools an engineer needs to develop and prototype Bluetooth applications with Stellaris. The solution is well-suited for applications such as cell phone and mobile device accessories, medical data aggregator and for short range serial cable replacement.
Order now
SmartRF™ Studio 7 version 1.5.0
SmartRF Studio is a Windows application that can be used to evaluate and configure low power RF-ICs from TI. The new version 1.5.0 has the following updates:
  • Support for CC110L, CC113L and CC115L, CC1120 and CC1121.
  • Improved settings view with categories organized in a tree structure.
  • New feature to change the packet interval in Packet TX.
  • Automatic scrolling added to the packet view in the Packet RX panel.
  • Improved documentation of script module.
  • Support for all CC430 devices.
  • Register settings for CC1101-CC1190 updated.
  • Added support for fixed packet length.
SmartRF™ Studio 7 version 1.5.0
Download now on www.ti.com/smartrf
SmartRF™ Packet Sniffer version 2.15.1
TI’s Packet Sniffer is a PC software application used to display and store RF packets captured with a listening RF Device. The new version has support for the new hardware platform TrxEB and the CC1120, CC1121, CC1101, CC110L or CC113L evaluation modules. The new version includes bug fix for RF4CE packet parsing and new structure and updated configuration files for radio registers.
Download now
Technical Documents
DN037 Measurement Results for Combined CC2530 and CC2590 Solution
The design note gives measurement results for the combined CC2530-CC2590 solution at 3 V operation, -40C, +25C, +and 85C. The following parameters are measured: sensitivity, RX current, output power and harmonics, TX current, EVM, and stability versus load impedance.
More
AN101 Using 1 W RF3858 Front End with CC1101 under FCC 15.247
This application note outlines the expected performance when using a RF3858-CC1101 design under FCC Section 15.247 in the 902-928 MHz frequency band. The RF3858 is a single-chip front-end module from RFMD. The maximum output power for the combined solution is 1 W and the sensitivity is improved 5-6 dB compared to a CC1101 stand-alone solution.
More
RF3858-CC1101 Reference Design
The RF3858-CC1101 reference design includes schematic, gerber files and a bill of materials. It is highly recommended to follow the reference design for optimum performance.
More
New revision of CC1101 data sheet
Added references to CC1190 for long-range applications and TPS62730 dc-dc converter for reduced battery current consumption. See revision history at the end of the document for further changes.
More
TrxEB Software Examples User’s Guide
The user guide describes how to use the RF software examples that are pre-programmed on the MSP430 on the SmartRF Transceiver Evaluation Board (TrxEB) – the development platform for TI’s low power RF sub-1GHz products. The software examples include:
  • Packet Error Rate test (PER test) for range testing. The PER test currently supports CC1101, CC11xL, CC112x, CC1101-CC1190, and CC1120-CC1190
  • Simplelink test, which is a one way link between two nodes where the Master continuously transmits packets to the Slave. The test currently supports link between two CC1120 devices or two CC1101 devices.
  • RX Sniff test, which is a simple demonstration of the RX Sniff Mode feature of the CC1120. It sets up a simple link between a Master and a Slave node where the Master node sends a packet to the Slave each time the user presses the button on the TrxEB. This application will only work with a CC1120 connected to the TrxEB.
Download the TRxEB Software Examples User’s Guide
Other News
Reducing Bluetooth® low energy power consumption with TPS62730 step down converter
TI recently released the TPS62730, which is good news for anyone wanting to reduce power consumption in an RF device, regardless of whether it is Bluetooth low energy-based, or it is using a different RF protocol.
Read Karl’s blog post about the new marvel
Wireless connectivity solutions for Telehealth applications
Visit www.ti.com/telehealth to learn more about wireless connectivity solutions such as Bluetooth®, Bluetooth® low energy, ZigBee®, ANT™ and Wi-Fi. View telehealth aggregation manager system block diagrams and IC product specifications, collateral, training content and tools.
www.ti.com/telehealth
Events
Welcome to TI’s multimedia living room at IBC Amsterdam, 8-13 September 2011
Experience new innovations for advanced multimedia services at Texas Instruments’ booth # 9.B19 in Hall 9. Meet with the TI experts and see demonstrations of technologies that enable vivid multimedia content creation and delivery: DaVinci™ Digital Video Processors, OMAP™ Application Processors, WiLink™ combo wireless connectivity solution, PurePath™ Wireless Audio, and ZigBee® RF4CE for remote control applications.
www.ibc.org
Join TI at ESC Boston, 26-29 September 2011
Visit the Texas Instruments booth # 1530
http://esc.eetimes.com/boston/
Sign up for the Bluetooth Technology Conference in Munich, Germany, October 4th 2011
What about celebrating the end of Oktoberfest with a technology highlight? The European Bluetooth Technology Conference is coming to Munich on October 4.
Take this unique chance to get to know international experts, learn more about the application potential and enhance your business potential with Bluetooth® technology. As one of the sponsors of the conference, Texas Instruments’ Bluetooth low energy experts will be there to discuss how the new Bluetooth low energy technology will influence future applications and way of living. Meet with the TI team, see demonstrations and discuss your Bluetooth low energy design.
Register on www.navispace-events.de
Experience TI’s PurePath™ Wireless digital audio streaming solution at AES New York, Oct 20-23 2011
Meet with TI’s audio experts (booth #847) and check out the latest devices, resources and tools available to support your audio design needs. Experience TI’s latest audio developments, including TI’s PurePath Wireless audio product family of 2.4 GHz audio ICs that transmit uncompressed CD-quality wireless audio over a rock solid radio frequency link.
See you at AES
Wireless Connectivity SpeedWay Design Workshop™ with TI and Avnet
SpeedWay logo Need hands-on training with designing, building and testing a wireless design? Join Avnet and TI for our RF & Wireless SpeedWay training. All attendees will receive an eZ430-chronos kit.
Register today!
Texas Instruments Technology Days 2011 – Join us for a day packed with technical design seminars and technology exhibits
Texas Instruments Technology Days 2011 The IC training is aimed at providing a learning forum for design engineers where practical high-performance solutions, tools and workshops are presented for analog and digital technologies. The exhibits demonstrate the latest TI technology. Don’t miss this opportunity to meet with a number of Texas Instruments’ experts and gain valuable ideas for solving your technical challenges!
Coming up next
Americas: Boston September 13, Anaheim October 4, Long Island October 11, Rochester October 13, DC October 18, Philadelphia October 20, Dallas October 26
Europe: Stuttgart, Germany September 19, Tel-Aviv, Israel October 25, Milan, Italy October 20
Asia: Beijing September 20, Shanghai September 22, Shenzhen September 27
Visit www.ti.com/techdays for a complete list of our Technology Days worldwide.
Customer Support Contact Information
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