Dear %%FIRST_NAME%% %%LAST_NAME%%,
Welcome to the Low-Power RF and Wireless Connectivity eNewsletter from TI – the newsletter that keeps you up to date on new software and hardware releases, developer’s news, and other news and events associated with TI’s radio frequency and wireless connectivity solutions.
In this issue:
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| Tools |
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| Technical Documents |
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Developer’s News
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Other News
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| Events |
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Featured Video:
LED lighting control and Smart Energy from TI
Bill Wong of Electronic Design magazine talks with Jonas Olsson and Mark Grazier at Texas Instruments about LED lighting control with 6LoWPAN technology, ZigBee Smart Energy radio solutions and TI’s new CC1120 sub-1 GHz RF performance line.
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| E2E online community - what are engineers discussing right now? |
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| Hardware & Software |
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| New! PurePath™ Wireless audio products with USB support |
 TI just introduced two system-on-chip (SoC) solutions in the PurePath™ Wireless audio product family, aimed at delivering uncompressed, CD-quality wireless multichannel and multipoint audio streaming capabilities to consumer applications with USB ports, such as PCs, TVs, set top boxes, game consoles and more. The new single-chip CC8521 and CC8531 SoC solutions contain USB audio support for all major operating systems and can enable streaming of up to four simultaneous audio channels from one USB audio source. Together with a corresponding USB dongle reference design, the new PurePath Wireless products allow developers to design low-cost, small USB dongles for wireless audio applications, without code development or in-depth understanding of USB protocols.
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Find out more on www.ti.com/purepathwireless |
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| RF selectivity and blocking – Why should I care? |
TI recently launched a new family of high-performance RF devices for ISM bands at 169, 433, 868, 915, and 955 MHz. The most important design criteria for this new CC1120 sub-1 GHz RF performance line platform has been to offer the highest-performing RF devices on the market. High RF performance is a vague term – and perhaps an unfamiliar one for most average consumers. In a recent post on TI’s Mobile Momentum blog TI’s Erling Simensen has mapped commonly used performance parameters to real-life scenarios to share the benefits this can really bring to end users. |
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Read the blog post |
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| Watch the EE Times Webinar on TI’s new CC1120 sub-1 GHz RF performance line |
Integrated low-power RF devices for sub-1 GHz communications have been around since one decade or so. Based on its very successful CC1101 family, TI has now achieved the next level in terms of RF performance and differentiated features by introducing the industry’s highest performing sub-1 GHz parts - the CC1120 family. In this webinar, TI’s Milen Stefanov will talk about the CC1120 features and how these fit into the applications like smart metering and home automation. The webinar is available on demand. |
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Watch now
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| Tools |
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| CC430-based sub-1 GHz spectrum analyzer tool now available |
|  The MSP-SA430-SUB1GHZ spectrum analyzer is a CC430-based reference design that can be used to implement an easy and affordable tool to jumpstart RF development in the sub-1 GHz frequency range. More and more electronic devices include a built-in RF link. RF transceivers are inexpensive, but the equipment to design and debug such systems is not. The CC430-based spectrum analyzer provides an affordable development tool that reduces the time needed on expensive measurement equipment. The system is recognized as a USB device and is operated from a powerful yet simple graphical user interface that is available for free to download.
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| Technical Documents |
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| Other News |
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| A perfect match: TI’s microcontrollers + wireless connectivity |
TI’s MSP430 and Stellaris microcontrollers (MCU) are an ideal fit for numerous wireless solutions with their unique combination of ultra-low power consumption and high performance integrated analog. By making wireless connectivity design easy, performance-rich and power-efficient, TI’s MCU’s help advance networking applications for personal area networks, mesh and IP networks, proprietary protocols and RFID. TI MCU and RF solutions are perfect for applications that include, but are not limited to, sensor hubs, wireless audio, remote controls, and personal health. They’re also ideal for home and building automation applications such as alarm and security systems, automatic meter reading systems, active and passive RFID/NFC systems and other monitoring and control systems. |
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Read more on www.ti.com/embeddedrf |
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| Connecting Bluetooth® low energy devices to Windows |
Until now, low power wireless connectivity in PC’s has required using proprietary technologies that incur the cost and complexity of shipping an external dongle. Bluetooth low energy enables these same low power scenarios using a standard Bluetooth radio and creates the opportunity to connect Windows with a wide range of new devices. In this video session from Build Windows conference 2011, you will learn more about this new technology and how device makers can use Bluetooth low energy to integrate low power devices with Windows. Included is also a demo of TI’s CC2540 Bluetooth low energy development kit which works out of the box with Microsoft WPD samples. |
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Watch now |
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| The Roundtable – Interactive Intelligent Devices |
Moderated by Alix Paultre, Editorial Director, the Wireless Design and Development Roundtable is where industry players talk about market and industry trends. This month's question is: Now that today’s products must not only be intelligent, they must be interactive with users and fellow devices over a network. What do you feel the greatest challenge to the engineer is to achieve that functionality? View the thoughts of industry experts like Texas Instruments’ Dave Lacinski, Wireless Connectivity Solutions. |
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| TI’s Smart Energy Profile Solutions |
The Smart Energy Profile (SEP) is a public application profile that is used in Smart Grid applications such as metering and home area networks. The device types supported by the Smart Energy Profile include energy service interface, metering device, in-home-display, programmable communicating thermostat, load control devices, and more. TI offers comprehensive software and hardware solutions to implement Smart Energy Profile applications for such device types. |
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Download TI’s SEP fact sheet |
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| Introducing TI’s complete WMBus solution |
| TI has leveraged its silicon technology to develop a new MCU + RF solution that offers the multiple evaluation platforms for testing and enabling WMBus (EN13757-x) wireless communication for smart meters (gas, water, heat and e-meters), sub-metering (heat cost allocators) and data concentrators. |
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Download TI’s WMBus fact sheet |
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| Events |
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| See you at Wireless Congress 2011: System & Applications, November 9-10, Munich, Germany |
Meet with TI’s wireless connectivity experts and check out the latest devices, resources and tools available to support your wireless design needs. Experience demonstrations of TI’s latest developments, discuss your wireless connectivity design with TI experts and gain further knowledge by attending some of TI’s presentations at the event. |
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Find out more on www.wireless-congress.com |
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| Register today for free eTech Day on-demand training |
Join TI for on-demand technical design seminars from the comfort of your own desk! Seminars are archived until November 16. |
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For more information, please see www.ti.com/etechdays |
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| Bluetooth Evolution Conferences, Taipei November 22 and Tokyo December 7 2011 |
Meet with TI’s Bluetooth low energy experts at the Bluetooth Evolution Conferences in Taipei and Tokyo on November 22 and December 7, respectively. Organized by the Bluetooth SIG, the Bluetooth Evolution Conferences will provide a wide variety of topics, including chipset solutions, new use cases, testing solutions, consumer electronic applications, and medical insights. The events will provide full information about Bluetooth Core Specification Version 4.0, from product development to testing. |
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For more information, go to Bluetooth Training and Events |
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| Texas Instruments Technology Days 2011 – Join us for a day packed with technical design seminars and technology exhibits |
 The IC training is aimed at providing a learning forum for design engineers where practical high-performance solutions, tools and workshops are presented for analog and digital technologies. The exhibits demonstrate the latest TI technology. Don’t miss this opportunity to meet with a number of Texas Instruments’ experts and gain valuable ideas for solving your technical challenges! |
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Coming up next
Americas: Ft. Lauderdale, FL- November 1, Orlando, FL- November 3, Austin Deep Dive- November 10, Toronto, ON Canada- November 15, Ottawa, ON Canada- November 17, San Jose, CA- December 8
Europe: Paris, France- November 9, Bochum, Germany- November 30, Birmingham, UK- December 7 |
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Visit www.ti.com/techdays for a complete list of our Technology Days worldwide. |
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| Customer Support Contact Information |
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Visit TI’s E2E™ Community and interact with your peer engineers, TI engineers, and other experts in order to ask questions, share knowledge, explore ideas, and help solve problems.
Product Information Centers
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