Hardware and Software |
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New Bluetooth® low energy system-on-chip increases battery life |
TI’s CC2541 Bluetooth low energy system-on-chip (SoC) offers a 33 percent reduction in power consumption compared to TI's previous-generation CC2540 SoC when transmitting at 1 milliwatt output power, while maintaining robust RF performance. The CC2541 is pin-to-pin compatible with the CC2540, which allows manufacturers to take advantage of the power savings through an easy migration of existing designs. |
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Learn more on www.ti.com/bluetoothlowenergy |
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430Boost-CC110L RF BoosterPack Video Introduction |
Had no time to check out TI’s 430Boost-CC110L RF BoosterPack yet? Watch the quick introduction video made by TI’s third party Anaren and get up to speed on how you easily can add wireless capabilities to MSP430™-based designs. |
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Achieve 20-30% power savings in low-power RF devices |
TI expands its family of companion power supplies for wireless connectivity applications with the new TPS62733 – a high-frequency synchronous step-down DC/DC converter optimized for ultra-low-power wireless applications. The device reduces the current consumption drawn from the battery during TX and RX mode by a high-efficient step-down voltage conversion. |
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Tools |
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CC2541 Bluetooth® low energy Evaluation Module Kit |
The CC2541 Evaluation Module Kit (CC2541EMK) development kit simplifies and reduces design time for new Bluetooth Smart devices. The CC2541EMK contains two plug-in boards and antennas. Use them together with SmartRF05EB from the CC2540 Development Kit (CC2540DK). The evaluation modules can be used as a reference board for prototyping and for verifying the performance of the CC2541 RF IC. Available now on TI’s eStore for $99. |
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Technical Documents |
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AN097 Current Savings in CC254x Using the TPS62730 |
This application note outlines the current savings in CC254x Bluetooth® low energy SoC using TPS62730 step down DC-DC converter. The TPS62730 reduces the peak current drawn by the CC254x in active mode without compromising on RF performance.
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Other News |
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Wireless Connectivity Solutions for Smart Grid |
TI’s wireless connectivity solutions for Smart Grid include RF ICs, metering protocol stacks and dedicated profiles. Technologies include proprietary sub-1-GHz, ZigBee®-SE, ZigBee-IP from 2010, wM-Bus and 6LoWPAN.
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Events |
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Texas Instruments Technology Days 2012 - Join us for a day packed with technical design seminars |
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TI Technology Day coming to a city near you! |
TI Tech Days provide a learning forum for design engineers where practical high-performance solutions, tools and workshops are presented for analog and digital technologies. The exhibits demonstrate the latest TI technology. Don’t miss this opportunity to meet with a number of Texas Instruments’ experts and gain valuable ideas for solving your technical challenges! |
Coming up next:
Americas: St. Paul, MN May 2, Dallas, TX May 8, Cleveland, OH May 15, Mexico City, Mexico June 14, Toronto, Canada June 21
Europe: Stuttgart, Germany May 3 (tbc), Nürnberg, Germany July 2 (tbc)
Visit www.ti.com/techdays for a complete list of our Technology Days worldwide. |
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Customer Support Contact Information |
Visit TI’s E2E™ Community and interact with your peer engineers, TI engineers, and other experts in order to ask questions, share knowledge, explore ideas, and help solve problems.
Product Information Centers
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