Dear %%FIRST_NAME%% %%LAST_NAME%%,
Welcome to the Low-Power RF and Wireless Connectivity eNewsletter from TI – the newsletter that keeps you up to date on new software and hardware releases, developer’s news, and other news and events associated with TI’s radio frequency and wireless connectivity solutions.
In this issue:
| Hardware & Software |
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| Tools |
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| Technical Documents |
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Developer’s News
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Other News
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| Events |
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Featured Video:
E2E online community - what are engineers discussing right now?
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| Hardware & Software |
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| New sub-1 GHz RF BoosterPack for ultra-low-power MSP430™ LaunchPad development kit |
 TI has released a new sub-1 GHz RF value line plug-in-board for TI’s MSP430™ microcontroller LaunchPad development kit. The 430BOOST-CC110L RF BoosterPack includes an ETSI-compliant and FCC-certified module to help speed development time, reduce certification costs and eliminate barriers associated with the RF hardware design process. The RF BoosterPack and MSP430 LaunchPad offer developers affordable solutions for cost-sensitive sub-1 GHz RF applications such as remote controls, toys, home and building automation, and security systems. The 430BOOST-CC110L is available today for $ 19, and the MSP430 LaunchPad is separately available for $ 4.30. |
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For more information and to order, visit www.ti.com/rfboosterpack. |
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| TI Sub-1 GHz wireless connectivity solutions – for every budget and design requirement |
 TI offers a broad portfolio of sub-1 GHz wireless connectivity RF ICs for both high-performance and cost-sensitive applications. Featuring the industry’s highest RF performance, TI’s new sub-1 GHz CC1120 RF performance line www.ti.com/rfperformanceline brings more robust, reliable wireless connectivity to metering, security and industrial automation applications. The sub-1 GHz CC11xL value line www.ti.com/rfvalueline family of products promises wireless connectivity for more of today’s cost sensitive consumer applications, such remote controls, toys, and other consumer electronics, as well as home & building automation, and alarm & security applications. |
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| New Smart Energy Profile – SEP 2.0. system release, featuring ZigBee and Wi-Fi. |
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Learn about Smart Energy Profile 2.0 and TI’s solutions by watching our latest video. TI’s Smart Grid Business Development Manager Andrew Soukup demonstrates TI’s SEP2.0 system operating over three different communications standards; a ZigBee IP low-power wireless network, an Ethernet link, and Wi-Fi. |
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Watch now
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| Tools |
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| Wi-Fi Direct™ enabled AM335x ARM Cortex-A8 microprocessors evaluation module |
 The AM335x evaluation module includes TI’s WL1271 single-chip 802.11b/g/n + Bluetooth® technology in a broadly available module and is the first widely available platform to enable Wi-Fi Direct. The combination of the AM335x ARM Cortex-A8 microprocessors and proven WL1271 solution provides a very low-cost, high-performance wireless connectivity platform with a seven-inch LCD touch screen and access to all peripherals for $995.
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Order now
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| Technical Documents |
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| AN110 – Using CC1190 Front End with CC112x under FCC 15.247 |
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This application note outlines the expected performance when using a CC1120-CC1190 design under FCC Section 15.247 in the 902-928 MHz frequency band. The maximum output power is +27 dBm @3.6V and the sensitivity is improved 2-3 dB compared to a CC1120 stand-alone solution.
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| CC1120+CC1190 915 MHz Reference Design |
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The CC1120-CC1190EM 915 MHz reference design contains schematics and layout files for the CC1120-CC1190EM 915 MHz evaluation module. The RF section has been designed and characterized for operation in the 902-928 MHz frequency band. The maximum output power is +26 dBm @3.6V and the sensitivity is improved 2-3 dB compared to a CC1120 stand-alone solution.
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| New revision of DN025 Johanson Technology Matched Balun Filters for CC110x & CC111x |
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The design note has been updated with the latest balun filter from Johanson Technology (JTI) that is specifically designed for the CC110x and CC111x family of ICs. Using the new filter balun, the RF section component count between the IC and the antenna is reduced to a single component (excluding any antenna impedance matching components) and the same PCB footprint can be used for 433, 868 and 915 MHz. The design note also describes the advantages of the existing discrete balun reference design, the value line reference design that use PCB inductors in the balun, and the JTI matched filter balun reference designs. |
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| Events |
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| CES 2012, January 10-13, Las Vegas: Meet with TI’s Wireless Connectivity team |
Going to CES? Meet with TI’s Wireless Connectivity team, see our latest developments, and discuss your next application design with our wireless experts. Contact us here to schedule a meeting – we look forward to hearing from you.
TI will be showcasing low-power wireless connectivity solutions for a variety of consumer electronics applications, such as RF-based ZigBee® RF4CE for advanced remote controls, ZigBee networking for Smart Grid applications and PurePath™ Wireless Audio for wireless headsets and speakers. Experience our latest Bluetooth® low energy developments and ultra-low power ANT™ solutions for consumer medical, mobile accessories, and sports and wellness applications.
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See www.ti.com/wirelessconnectivity for more information |
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| Bluetooth Evolution Conferences, Taipei November 22 and Tokyo December 7 2011 |
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Meet with TI’s Bluetooth low energy experts at the Bluetooth Evolution Conferences in Taipei and Tokyo on November 22 and December 7, respectively. Organized by the Bluetooth SIG, the Bluetooth Evolution Conferences will provide a wide variety of topics, including chipset solutions, new use cases, testing solutions, consumer electronic applications, and medical insights. The events will provide full information about Bluetooth Core Specification Version 4.0, from product development to testing.
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For more information, go to Bluetooth Training and Events |
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| Texas Instruments Technology Days 2011 – Join us for a day packed with technical design seminars and technology exhibits |
 The IC training is aimed at providing a learning forum for design engineers where practical high-performance solutions, tools and workshops are presented for analog and digital technologies. The exhibits demonstrate the latest TI technology. Don’t miss this opportunity to meet with a number of Texas Instruments’ experts and gain valuable ideas for solving your technical challenges! |
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Coming up next
Americas: San Jose, CA- December 8
Europe: Birmingham, UK- December 7 |
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Visit www.ti.com/techdays for a complete list of our Technology Days worldwide. |
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| Customer Support Contact Information |
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Visit TI’s E2E™ Community and interact with your peer engineers, TI engineers, and other experts in order to ask questions, share knowledge, explore ideas, and help solve problems.
Product Information Centers
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