 |
 |
|
|
|
|
Dear %%FIRST_NAME%% %%LAST_NAME%%,
The Wireless Connectivity eNewsletter from TI keeps you up to date on new software and hardware releases, developer's information, and news and events associated with TI's wireless connectivity solutions.
|
|
|
|
|
|
|
|
|
| Hardware and Software |
 |
| TI named ZigBee® IP golden unit |
|
| The The ZigBee Alliance recently announced the ZigBee IP specification and that TI has achieved golden unit status. ZigBee IP offers cost-effective and energy-efficient wireless mesh networking based on standard Internet protocols, such as 6LoWPAN, IPv6, PANA, RPL, TCP, TLS and UDP. TI’s Joseph Reddy participated on a ZigBee Alliance panel to explain ZigBee IP features, benefits, technical capabilities and more. |
|
 |
The archived webinar can be accessed here. |
|
|
| New Tiva™ C Series ARM® Cortex™-M4 MCUs for connected applications |
|
| Building on more than 20 years of experience developing leading MCU technology and ARM®-based processors, TI recently announced its new Tiva ARM MCU platform. The first devices in the new platform – Tiva C Series TM4C123x ARM Cortex-M4 MCUs – are the first Cortex-M-based MCUs to be built on 65 nanometer flash process technology, setting the roadmap to higher speeds, larger memory and lower power. |
|
|
| MSP430 value line expands with more memory, connectivity support |
|
|
MSP430 recently expanded its Value Line portfolio of 16-bit microcontrollers to allow designers a code-compatible upgrade path, expanding memory from 16kB up to 56kB Flash and up to 4kB SRAM, enabling customers to migrate existing solutions and support connectivity protocols such as wireless MBUS and near field communications (NFC). By combining the increased memory resources and integrated capacitive touch IOs on the MSP430G2xx5 devices, developers can implement more sophisticated capacitive touch capabilities like swipe, gesturing, double tap and proximity effects within their applications.
|
|
|
Read more here and here. |
|
|
| Back to top |
|
| Other News |
|
| TI’s Bluetooth® low energy SensorTag is an EE Times EDN Ace Award Winner! |
|
 The results are in and TI’s Bluetooth low energy SensorTag just won the EE Times EDN Ace Award for Best Development Kit or Evaluation Board!
Why SensorTag is so popular:
TI’s CC2541 Bluetooth low energy SensorTag is the first Bluetooth Smart development kit focused on wireless sensor applications and the only development kit targeted for smart phone app developers. The CC2541 SensorTag is designed to shorten the design time for Bluetooth app development from months to mere hours and can be used as a reference design and development platform for a variety of smartphone appcessories including those for Health and Fitness, Medical Applications, Educational Tools, Toys, Remote Controls and Mobile Phone Accessories.
TI’s SensorTag is also compatible with TI’s BLE-Stack™ software for easy over-the-air (OTA) downloads from a smartphone or tablet so you can update your devices in a snap.
Don’t fall behind the SensorTag trend! Purchase YOUR Bluetooth low energy SensorTag from the TI eStore for ONLY $25!
|
|
|
Purchase YOUR SensorTag today!. |
|
|
| Wireless connectivity shines in the MCU BoosterPack contest |
|
|
TI recently finished both external and internal TI BoosterPack contests to see what ideas engineers could come up with to support the various LaunchPad evaluation kits. The external contest winners were a precision charge amplifier BoosterPack, stelariscope BoosterPack for RGB LED arrays, and a 12-servo BoosterPack. The internal TI contest generated several great connectivity-driven applications:
Want your own LaunchPad evaluation platform or BoosterPack kit to jumpstart your development?
|
|
|
Check out the selection here. |
|
|
| Bluetooth Is for the Internet of Things – Thoughts from Bluetooth World |
|
|
The Bluetooth SIG held the first Bluetooth World conference in Shanghai, China April 10-11. The conference showcased the latest Bluetooth technologies and applications and what is coming including how Bluetooth connects in the Internet of Things.
|
 |
|
|
|
| Back to top |
|
| Training & Events |
|
| Write your own Bluetooth Smart sensor app in under an hour – webinar |
|
| Bluetooth Smart is powering everything from “appcessories” to the Internet of Things. TI recently partnered with the Bluetooth SIG to present a webinar on how to write your own Bluetooth Smart sensor app in under an hour. |
|
|
The archived webinar can be accessed here. |
|
|
| Get the latest technology, expert knowledge, and tools that you need to get to market fast at TI 2013 Tech Days! |
|
 See the latest cutting-edge analog and digital technologies across a wide range of applications. Hear in-depth insights, receive hands-on training and walk away with samples and discounted tools to help solve your technical design challenges and accelerate your time-to-market. Join fellow design engineers at TI Tech Day, coming to a city near you.
|
Upcoming events in the Americas:
- Saint Paul, Minnesota – May 1st
- Cleveland, Ohio – May 16th
- Mexico City, Mexico – June 20th
- Sao Paulo, Brazil – June 26th
- Boston, Massachusetts – September 19th
- Detroit, Michigan – September 26th
- Santa Barbara, California – October 29th
- Anaheim, California – October 30th
- Toronto, Canada – November 7th
|
|
|
Register now! |
|
|
| Back to top |
|
| Customer Support Contact Information |
|
Visit TI’s E2E™ Community and interact with your peer engineers, TI engineers, and other experts in order to ask questions, share knowledge, explore ideas, and help solve problems.
Product Information Centers
|
|
|
|
|
|
|
|
| Back to top |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
