The Texas Instruments ASIC package selection varies with each techology, but the general offering includes:

• Flip chip
• Thin quad flat pack (TQFP), die up
• PowerPAD quad flat pack, die up
• MicroStar BGA ball grid array, die up
• Generic ball grid array (GBGA), die down
• Plastic ball grid array (PBGA), die up
• Tape ball grid array, type 2 (TBGAII), die down

Most of these packages use copper as the leadframe material to enhance thermal handling capacity.

For a list of packages available for a specific technology library, see the product overview for that library.