16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
TI?s 56-ball MicroStar Jr.E package, registered under JEDEC MO-225, has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance, improving thermal performance, and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics, compared to the same functions in 48-pin and 56-pin TSSOP and TVSOP packages.
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