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Packaging: BGA MICROSTAR Marking Formats
Back to Top Side Marking Formats

Note 1: These package symbolization formats are typical of the majority of TI packages. For additional information on package markings,  please contact your local Product Information Center.

Note 2: In the actual package the TI Logo can be either "solid" or "outline". Either is acceptable.

Note 3: You may click on a package drawing to view its marking explanation.

Part Marking Look Up

BGA MICROSTAR
Pins Industry Standard TI Package Drawing (Click on an image to view explanation)
176 BGA MICROSTAR GGW
96 LFBGA ZKE
114 LFBGA ZKF