Wireless Handset Solutions: Wireless Connectivity Solutions

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TI's integrated, proven wireless connectivity solutions ensure multi-mode operation and access to a variety of wireless network connections for service any time, anywhere on a variety of wireless networks.

TI's highly integrated Bluetooth® technology, GPS and mobile WLAN hardware and software are developed with full understanding of the complete mobile phone system to give handset manufacturers a distinct competitive advantage.

White Paper

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  • Integrated combo solutions bring seamless mobile connectivity to
    wireless handsets

    26 March 2009  Download

 

A-GPSGPS
TI's GPS and assisted-GPS (A-GPS) solutions deliver fast and accurate location-based services within asynchronous and synchronous cellular networks. They are optimized for all current and developing wireless standards such as GSM, GPRS, EDGE, CDMA, UMTS and WCDMA.
Bluetooth® WPAN Technology Bluetooth® WPAN Technology
TI's single-chip Bluetooth solutions deliver high performance with low power and lower system cost, enabling manufacturers to provide optimized Bluetooth wireless personal area networking (WPAN) connectivity to their mobile devices.
Mobile Wireless LAN Mobile Wireless LAN
TI's mobile WLAN solutions deliver maximum battery life and Voice over WLAN functionality for dual system mobile phones that are driving seamless cellular and WLAN convergence.
WLAN and Bluetooth Coexistence WLAN and Bluetooth Wireless Coexistence
TI's Bluetooth and WLAN Coexistence Package provides hardware and software to eliminate interference in even the smallest wireless handsets. TI has led the charge to solve WLAN and Bluetooth networking coexistence and the company's coexistence solution has been used in mobile phones and PDAs for over two years.
OMAP Technology CenterIntegration Support
By extending its OTC program to non-cellular solutions, TI is speeding time to market for handset manufacturers who offer advanced 2.5G and 3G devices based on TI's OMAP platform and OMAP-Vox processors.

 

Availability Disclaimer

This product is intended for high-volume wireless OEMs and ODMs and is not available through distributors. If your company meets this description, please contact your TI sales office. For OMAP products now available for all customers and applications, please click here.

The Bluetooth® word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by Texas Instruments is under license. Other product or service names mentioned herein are the trademarks of their respective owners.