Bluetooth Technology - Availability Disclaimer

The BRF6150 is a highly integrated Bluetooth® Specification v1.2 single-chip solution. The BRF6150 integrates TI’s Bluetooth baseband, digital RF, ARM7TDMI® and power management into a single chip to enhance performance, reduce cost and minimize board space.

Get Started Now: Download the following documents for more information:

• BRF6150 Product Bulletin (TI_brf6100_brf6150.pdf, 218 KB)
  2004 Download
• Bluetooth wireless technology and 802.11 Coexistence product bulletin (TI_coexistence.pdf, 191 KB)
  2004 Download

BRF6150 Single-Chip Solution

• Full Bluetooth Specification v1.2
  • Including eSCO, AFH and faster connection
• Based on BRF6100 and exceeds its leading performance and features
• Improved power management
  • Direct connection to battery (2.7 V to 5.5 V)
  • Shut-down capability (6 µA)
  • 1.65 V to 3.6 V via LDO
  • RF TX: 25 mA
  • RF RX: 37 mA
  • Deep-sleep 30 µA
• Improved RF performance
  • Sensitivity -85 dBm
  • TX Power + 7 dBm and Class 1 ready
  • Blocking ~0 dBm at GSM bands
• Highly optimized for mobile terminals
  • Direct connection to battery
  • 11 external passives
  • PCB layout area 50 mm2
  • McBSP compatible I/F
  • Supports 12-MHz to 40-MHz Fclk signal
• Superior coexistence mechanisms
  • Collaborative interface with WLAN
  • Bluetooth v1.2 AFH
• Complete reference designs with TI’s TCS chipsets and OMAP platform
• Digital Radio Processor (DRP) Technology
  • Digitally intensive
  • RF BIST (built-in-self-test)
• Production Line optimized
  • Calibration free
• Smaller Package
  • 4.5 x 4.5 x 0.8 ROM
  • 4.5 x 4.5 stacked-flash prototypes
• Manufactured in TI’s 130 nm CMOS FAB to meet mass-production needs

The BRF6150 is ideally suited for low cost, high volume applications such as mobile handheld devices where performance and space are critical. Utilizing an advanced architecture, the BRF6150 leverages TI’s 130nm digital CMOS process while while incorporating the advantages of digital RF processing.

This high level of integration allows the solution form factor to drop to 50mm² which is achieved through the integration of power management, PLL, loop filter, antenna switch, filters and other analog functions that were previously external.

Back to Top