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Product is Not Recommended for New Design (NRND)

For the latest parts, please visit: www.ti.com/bluetooth



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BluetoothThe BRF6100 is TI’s first generation highly integrated CMOS Bluetooth® wireless technology single-chip solution forming a complete Bluetooth wireless communications unit. This device integrates the Bluetooth wireless technology baseband, digital RF, memory (ROM & RAM), and power management on one chip to enhance performance, reduce cost and minimize board space.

Get Started Now: Download the following documents for more information.

  • BRF6100 Product Bulletin (TI_brf6100_6150.pdf, 218 KB)
    2004 Download
  • BRF6100 Starter Kit bulletin (bluetoothtools_120402.pdf, 1 MB)
    2004 Download
  • Bluetooth Wireless Technology and 802.11 Coexistence Product Bulletin (TI_coexistence.pdf, 191 KB)
    2004 Download
  • Bluetooth Wireless Technology Transceiver Complete in CMOS Brief (bluetoothcmos_120402.pdf, 112 KB)
    2004 Download

BRF6100 Single-Chip Solution

  • Digital RF Processing (DRP) technology:
    • 90% digital (including loop filter)
    • RF Built-in Self Test (BIST)
    • Process: 0.13u CMOS
  • Lowest power consumption:
    • RF TX 25 mA and RF RX 37 mA @ 1.8V
    • Deep sleep 25uA (including LDO)
    • HV3 < 25 mW
  • Highly optimized for cellular:
    • Lowest solution cost
    • Less than 15 external passives
    • Actual layout area less than 75 mm² (FR4)
    • Automatically detects fast clock frequencies from 8 MHz to 40 Mhz (20 KHz to 40 KHz granularity)
  • Full throughput from all cellular clocks (723.2 Kbps in DH5)
  • Sensitivity: -85dBm (0.1% BER)
  • Bluetooth specification v1.1 certified (class 2 and 3)
  • 1.7 - 3.6V unregulated supply voltage
  • On-chip LDO power regulators
  • -40ºC to + 85ºC Bluetooth certified operating temperature
  • Collaboration I/F with 802.11b
  • Seamless integration with TI’s mobile wireless LAN, OMAP Platform, TCS chipset solutions

The advance architecture leverages the TI 0.13u digital CMOS process while taking advantages of the unique high performance process properties for digital RF processing.

This high level of integration allows the solution form factor to drop below 90mm² which is achieved through the integration of power management, PLL, loop filter, antenna switch, filters and other analog functions that were previously external.




Availability Disclaimer

This product is intended for high-volume wireless OEMs and ODMs and is not available through distributors. If your company meets this description, please contact your TI sales office.

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