Bluetooth® Technology: BlueLink™ 6.0 Platform: BRF6350

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BlueLink 6.0 Platform (BRF6350) - Availability Disclaimer

As TI's fourth generation Bluetooth® single-chip, the BRF6350 is a digital CMOS solution that integrates a complete Bluetooth Specification v2.1+EDR system with an FM radio receiver on a single piece of silicon. TI's BRF6350 is a highly integrated device, including Bluetooth baseband, RF transceiver, ARM7TDMI®, memory (ROM and RAM), power management and an FM receiver.

Get Started Now: Download the following documents for more information:

  • Bluelink 6.0 Platform Product Bulletin (ti_bluelink_6_brf6350.pdf, 186 KB)
    2007 Download

BlueLink 6.0 Solution

Key Benefits:

  • Industry's best-performing Bluetooth specification 2.1 + EDR and highest fidelity FM stereo and mono performance on a single chip
  • Integration of Bluetooth and FM in the same silicon provides 25 percent solution size savings compared to discrete solution
  • Proven Bluetooth-FM RF co-existence
  • Complete software stack support for Bluetooth and FM, enabling ease of design and quick time-to-market
  • On-chip power management adapted to cellular applications
  • Incorporates TI's Bluetooth and WLAN co-existence hardware and software solution, providing a collaborative interface with TI's mobile WLAN chipsets
  • Uses TI's DRP™ technology and is manufactured using 90-nm CMOS to deliver smallest and lowest cost Bluetooth and FM single-chip solution


General Features:

  • Highly optimized for mobile terminals
    • Supports major cellular reference frequencies
    • Small PCB layout area: 45 mm2
    • McBSP compatible I/F
    • Low power consumption
  • Flexibility to be easily integrated into various host system topologies:
    • The Bluetooth and FM interfaces could be separated from each other (e.g. separate host interface, separate digital audio)
    • The Bluetooth and FM interfaces could be shared (e.g. same host interface, same digital audio)
  • The two functions can work simultaneously
    • FM receives/scans/sends RDS information to host, while Bluetooth can be in any operational mode
  • Small package
    • 3.88 x 3.52 x 0.62 Wafer Scale Package (WSP)
  • On-chip power management adapted to cellular applications
    • LDO support range: 1.7 V to 1.9 V
    • Direct connection to battery: 2.2 V to 5.4 V
    • Feeding from DC2DC
    • Power saving modes to minimize power consumption when Bluetooth and FM functions are not in use
  • Temperature detection and compensation mechanism ensures minimal variation in the RF performance over the whole temperature range
  • Complete reference designs with TI's TCS cellular chipsets and OMAP™ applications processors for fast time-to-market
  • Fully embedded FM receiver (including synthesizer and VOC tank)



Availability Disclaimer

This product is intended for high-volume wireless OEMs and ODMs and is not available through distributors. If your company meets this description, please contact your TI sales office.

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