WiLink™ 5.0 Mobile WLAN Solution - Availability Disclaimer

The WiLink™ 5.0 platform is the industry's first solution that integrates mobile WLAN (mWLAN), Bluetooth® and FM stereo audio all in a space-saving platform for mobile phones. The WiLink 5.0 solution provides fast time to market for handset manufacturers and caters to evolving consumer tastes for rapid data access, mobile entertainment and seamless connectivity between the WLAN and cellular networks.

TI brings seamless cellular and Wi-Fi® connectivity to consumers with VoWLAN functionality, optimized on TI's OMAP-Vox™ and WiLink solutions, enabling UMA on the handset across multiple operating systems such as Symbian™, Microsoft® Windows Mobile®, Linux® and low level operating systems. UMA provides consumers on-the-go voice access over WLAN or the cellular network using their mobile phones, and will transition to IMS as the fixed mobile convergence market matures.

The WiLink 5.0 platform integrates TI's WiLink 4.0 mWLAN single chip with its BlueLink™ 6.0 solution, which combines the industry's best performance Bluetooth with high fidelity FM stereo and mono performance on a single chip. The combination of mWLAN, Bluetooth and FM functionality allows users to perform a variety of simultaneous tasks, such as listening to the radio music on a Bluetooth headset while checking email via Wi-Fi.

Key Features:

• Module integrating TI's WiLink™ 4.0 mobile WLAN solution with the BlueLink™ 6.0 Bluetooth® and FM single chip
• VoWLAN functionality, optimized on TI's OMAP-Vox™ and WiLink solutions, enabling UMA on the handset
• 20% reduction in solution size and power consumption through use of TI's innovative DRP™ technology at 90 nanometer
• Advanced Bluetooth and WLAN coexistence through use of TI's second generation of Bluetooth/WLAN hardware and software co-existence package, enabling re-use of existing systems, quick time to market, and antenna sharing, reducing the bill of materials (BOM) for manufacturers
• Support for multiple operating systems: Symbian™, Microsoft® Windows Mobile®, Linux® and low level OSs
• Multiple package options, including on-board and module solutions

Both devices in the WiLink 5.0 module are manufactured in TI's innovative DRP™ technology at the 90 nanometer node, which cuts both solution size and power consumption by up to 20 percent over competitive solutions, in critical modes of operation.

With three co-located radios, efficient management of RF is required for simultaneous operation of WLAN, Bluetooth and FM applications. The WiLink 5.0 platform takes advantage of TI's expertise from the company's previous generations of mobile WLAN solutions, which are being shipped in more than 25 mobile handset devices and cellular convergence products today. The platform uses the second generation of TI's Bluetooth/WLAN hardware and software coexistence package, enabling re-use of existing systems, quick time to market and antenna sharing, reducing the bill of materials (BOM) for manufacturers.

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