WiLink™ 6.0 single-chip WLAN, Bluetooth® and FM solutions - Availability Disclaimer

TI's WiLink™ 6.0 mobile platform is a complete hardware and software offering comprising proven, carrier-quality mobile WLAN, Bluetooth® and FM cores integrated into a single chip. The WiLink 6.0 single-chip solutions are manufactured in a 65-nm CMOS process and use TI's DRP™ technology to deliver low-power, small form-factor and low cost requirements of handset manufacturers worldwide. Both solutions support Bluetooth specification v2.1 + EDR, and provide FM transmit and receive functions to turn the handset into a personal area broadcast device.

TI's WiLink 6.0 platform is optimized to work with OMAP 2, OMAP 3 and OMAP-Vox™ platforms including the OMAPV1030 and OMAPV1035 "eCosto" GSM/GPRS/EDGE solutions to provide complete modem, applications processor and mWLAN/Bluetooth/FM solution for low- to mid-tier handsets.

WiLink 6.0 Solutions
Solution	Supported Standards
WL1271	802.11 b/g/n
WL1273	802.11 a/b/g/n
Note: Both solutions support Bluetooth specification v2.1 + EDR and FM transmit and receive.

Download the product bulletin for more information:

• WiLink 6.0 Solutions Product Bulletin (ti_wilink_6.pdf, 230 KB)
  2007 Download

Key Features:

• Single-chip mobile WLAN, Bluetooth® and FM solutions implemented in 65-nm CMOS process using TI's DRP technology enables:
• Reduced power consumption for extended talk and standby times
• Bill of material reduction
• Small form factor
• Proven carrier quality to enhance the user experience with range-extended mobile WLAN (802.11a/b/g/n), Bluetooth Libson Release and FM functional cores
• Sophisticated ELP™ low-power technology and VoWLAN support with on-chip UMA and IMS acceleration for extended talk time and battery life
• Coexistence features enable simultaneous operation of each integrated function

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