TCS2305: LoCosto™ GSM - Availability Disclaimer

LoCosto single-chip family: TI's third-generation GSM-based solutions for the Ultra Low-Cost (ULC) Handsets

Leveraging an advanced 65-nm process with TMS320C54x™ DSP and ARM7™ cores in the same package, the TCS2305 GSM solution integrates TI's breakthrough digital RF DRP™ technology to offer the most compelling user experience in ultra-low cost handsets. Part of the LoCosto family, the TCS2305 enables handsets with high performance, robust functionality and innovative form factors in the most price-sensitive handsets. For example, the TCS2305 can implement the lowest cost color phones with a high degree of flexibility and scalability. Ideal for emerging markets such as India, China, Russia and Brazil where the next billion subscribers will come from, the TCS2305 LoCosto GSM chipset can also be deployed in enhanced handsets for value-conscious segments in more mature markets.

The sustainable ultra-low cost handsets structure of the LoCosto family begins with the 65-nm process, but is extended by additional chip- and system-level cost-optimization techniques, including an approximate 25% reduction in the electronic bill of materials (eBOM), reduced PCB area caused by smaller chips and greater silicon integration and a cost-optimized PCB technology.

A set of enhanced capabilities are now possible in ultra-low cost handsets, such as a relatively high-resolution color display without requiring additional external SRAM, high-end full duplex voice quality, near CD-quality MP3 and polyphonic ringers, longer talk time and standby time, stereo FM radio connectivity, USB charging, handsfree speakerphone operation, vibration ringer, headset support and other functionality.

Download the product bulletin for more information:

• LoCosto™ TCS2305 and TCS2315 solutions: TI's next-generation single-chip GSM/GPRS (ti_locostoULC.pdf, 320 KB)
  2008 Download

Key Benefits:

• Enables ultra-low cost handsets targeted at emerging, fast-growing regions as well as established, cost-sensitive markets
• Leverages 65-nm process with advanced DSP and ARM® technologies
• TI's proven DRP technology featuring integrated digital RF, now shipping in volume on previous LoCosto solutions
• Delivers a compelling next-generation user experience in ultra ultra-low cost handsets:
• Lowest cost color handset because no additional external SRAM memory is needed to support up to 128 x 160, 65k color displays
• Fast CPU processing for smooth user interface processing
• CD-quality (44.1 kHz) MP3 ringers and polyphonic ringers
• High-end full-duplex voice quality mitigates voice chopping and double talk
• Improved loudness (up to twice as loud) for noisy environments and hands-free operation
• FM connectivity with integrated stereo support
• Ability to record FM for on-the-fly ringers
• Optimized system design reduces component count and PCB board size compared to previous generations:
• Up to 25% reduction in eBOM
• Lower overall component count by 40%
• Smaller modem block footprint by as much as 35% reduces PCB board size and enables innovative handset form factors and larger batteries
• Lower power consumption for 30% longer talk time and 60 percent longer standby time
• USB charging for universal and easy charger access
• Flexibility for cost-sensitive and enhanced ULC handsets
• Hardware-based M-Shield™ technology for robust SIMLock, IMEI, and software/data security to protect users, operators and device manufacturers
• Scalable across regions, market segments, languages and subscriber types

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