Wafer Lot Acceptance
Method 2018 |
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| SPC Bond Process Monitor |
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100% / 100X Internal Visual
Method 2010 Condition A |
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Temperature Cycling Cond C 50 Cycles
Centrifuge Condition E |
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PIND
100%, 0 fall out or 5 cycles |
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Serialization (Symbol)
100% |
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X-ray Monitor
Real-time Video Inspection |
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Pre Burn-In Electrical test
As-Required |
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| Burn-in 240 Hr |
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Post Burn-In Electricals
PDA=3% |
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| 100% High / Low Electricals |
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Quality Conformance Inspection (QCI)
Group A (Method 5005) SS = 116/0 |
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Fine/Gross Leak Detection (Ceramic Only)
Method 1014 Condition B and C |
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External Visual
Method 2009 |
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QCI Group B and D
Group C by Wafer Lot |
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Note: Per MIL-PRF-38535, if sufficient quality and reliability data is available, the
manufacturer, through the QML program and the TRB, may modify, substitute,
or delete tests.
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Samples & Purchase Cart
