Electronic products and systems designed today are smaller and lighter, yet offer ever increasing functionality. Integrated circuit (IC) enhancements enable designers to improve performance and incorporate more features without trade offs in power consumption and interconnect parasitics.

The continuing drive for technology enhancements in automotive, computing, communication, medical, defense, and entertainment products places significant demand for utilization of bare die (unpackaged ICs) without sacrificing functionality, ease-of-use and cost.

TI's Medical HiRel group provides a wide range of products for sale in bare die, known good die and in wafer form. We specialize in value added processes include hybrid circuits, multichip modules (MCM), chip on board, flip chip and bumping.

HiRel has a dedicated die sales support team that provides a single point of contact for TI die and wafer solutions. TI HiRel support functions including:

• Sales and Applications Engineering
• Product and Test Engineering
• Quality & Reliability Engineering
• Process Engineering
• Planning

TI HiRel provides additional value to its existing IC technology and wafer fabrication processes by employing various screening methodologies based on the maturity and complexity of the product, as well as customer requirements. Processes employed by TI include DC probe, AC/DC probe at temperature, and full package-level screening including burn-in through the use of special carrier technologies or temporary packages.

Feasibility assessments are conducted for each opportunity to assess unique requirements related to die sales. The assessment takes into account such factors as:

• Customer requirements (qualification, inspection, radiation expectations)
• End application
• Probe Solution (HW)
• Probe Test Coverage versus datasheet
• Packing options (wafer, tape, waffle/gel pack)
• Test Platform

Typical Processing options include:

• Untested Die (Primarily sampling purposes)
• Probed Die – 25°C, 85°C, 125°C or special temp
• Wafers - can be tested or untested
• Die Thickness
• Minimum Bond pitch
• Marking
• Sidewall inspections
• Wafer Inspection
• Wafer Backgrinding
• Bond pad coordinates
• Mount and Bond Diagrams
• Shipping - Tape and reel, waffle packs, Custom trays, Gel Pak®