Altiumcustomize

Design Rule Verification Report

Date : 9/3/2014
Time : 5:25:50 AM
Elapsed Time : 00:01:30
Filename : \\10.0.20.114\g\LIVE JOBS\Altium\Skylake Bench Board RevE2\Design\09-03-2014\SKYLAKE_RevE2\Skylake.PcbDoc
Warnings : 0
Rule Violations : 86

Summary

Warnings Count
Total 0

Rule Violations Count
Silk to Silk (Clearance=2mil) (All),(All) 3
Silk To Solder Mask (Clearance=5mil) (IsPad),(All) 0
Minimum Solder Mask Sliver (Gap=3mil) (All),(All) 73
Minimum Solder Mask Sliver (Gap=0.7mil) (InComponentClass('Logo')),(InComponentClass('Logo')) 0
Hole To Hole Clearance (Gap=10mil) (All),(All) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=10mil) (Max=100mil) (Preferred=10mil) and Width Constraints (Min=15mil) (Max=15mil) (Preferred=15mil) (All) 0
Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All) 4
Pads and Vias to follow the Drill pairs settings 0
Hole Size Constraint (Min=7.874mil) (Max=270mil) (All) 0
Component Clearance Constraint ( Horizontal Gap = 10mil, Vertical Gap = 10mil ) (All),(All) 2
Component Clearance Constraint ( Horizontal Gap = 10mil, Vertical Gap = 10mil ) (IsThruComponent),(IsThruComponent) 0
Component Clearance Constraint ( Horizontal Gap = 10mil, Vertical Gap = 10mil ) (IsThruComponent),(IsSMTComponent) 0
Component Clearance Constraint ( Horizontal Gap = 10mil, Vertical Gap = 10mil ) (HasFootprint('0201*') or HasFootprint('0402*') or HasFootprint('0508') or HasFootprint('0603*') or HasFootprint('0612') or HasFootprint('0805*') or HasFootprint('0815*') or HasFootprint('0830*') or HasFootprint('1206*') or HasFootprint('1210*') or HasFootprint('1808*') or HasFootprint('1812*') or HasFootprint('1825*') or HasFootprint('2010*') or HasFootprint('2220*') or HasFootprint('2225*') or HasFootprint('2512*') or HasFootprint('2728*') or HasFootprint('3518*')),(HasFootprint('0201*') or HasFootprint('0402*') or HasFootprint('0508') or HasFootprint('0603*') or HasFootprint('0612') or HasFootprint('0805*') or HasFootprint('0815*') or HasFootprint('0830*') or HasFootprint('1206*') or HasFootprint('1210*') or HasFootprint('1808*') or HasFootprint('1812*') or HasFootprint('1825*') or HasFootprint('2010*') or HasFootprint('2220*') or HasFootprint('2225*') or HasFootprint('2512*') or HasFootprint('2728*') or HasFootprint('3518*')) 0
Component Clearance Constraint ( Horizontal Gap = 25mil, Vertical Gap = Infinite ) (InComponentClass('Mounting Holes')),(All) 4
Component Clearance Constraint ( Horizontal Gap = 5mil, Vertical Gap = 10mil ) ((HasFootprint('NY PMS 440 0025 PH'))),((HasFootprint('Keystone_1902C'))) 0
Component Clearance Constraint ( Horizontal Gap = 5mil, Vertical Gap = 10mil ) (InComponentClass('Logo')),(All) 0
Component Clearance Constraint ( Horizontal Gap = 0mil, Vertical Gap = 0mil ) (InComponentClass('Header')),(InComponentClass('Shunt')) 0
SMD To Corner (Distance=0mil) (All) 0
Acute Angle Constraint (Minimum=45.000) (All) 0
Minimum Annular Ring (Minimum=5mil) (All) 0
Minimum Annular Ring (Minimum=5.905mil) (IsVia and InAnyComponent) 0
Un-Routed Net Constraint ( (All) ) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Routing Via (MinHoleWidth=7.874mil) (MaxHoleWidth=40mil) (PreferredHoleWidth=10mil) (MinWidth=20mil) (MaxWidth=65mil) (PreferedWidth=20mil) (All) 0
Routing Via (MinHoleWidth=7.874mil) (MaxHoleWidth=12.992mil) (PreferredHoleWidth=7.874mil) (MinWidth=19.685mil) (MaxWidth=23.622mil) (PreferedWidth=19.685mil) (IsVia and InAnyComponent) 0
Routing Layers(All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=10mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Width Constraint (Min=5mil) (Max=100mil) (Preferred=10mil) (All) 0
Total 86


Silk to Silk (Clearance=2mil) (All),(All)
Text "V3.3Dx_EDP [3.3V,0.75A]" (706.35mil,144.28mil) Top Overlay Arc (760mil,670mil) Top Overlay
Text "V3.3Dx_EDP [3.3V,0.75A]" (706.35mil,144.28mil) Top Overlay Track (675mil,140mil)(700mil,115mil) Top Overlay
Text "V3.3Dx_EDP [3.3V,0.75A]" (706.35mil,144.28mil) Top Overlay Track (425mil,140mil)(675mil,140mil) Top Overlay
Back to top

Minimum Solder Mask Sliver (Gap=3mil) (All),(All)
Via (1785.98mil,1458.39mil) TOP LAYER to BOTTOM LAYER Pad C67-1(1831.13mil,1452.79mil) TOP LAYER
Via (1840.71mil,1569.87mil) TOP LAYER to BOTTOM LAYER Pad C67-2(1831.13mil,1532.79mil) TOP LAYER
Via (1461.4mil,2786.88mil) TOP LAYER to BOTTOM LAYER Pad U11-12(1454.472mil,2759.071mil) TOP LAYER
Via (2965.77mil,908.66mil) TOP LAYER to BOTTOM LAYER Pad C93-1(2980mil,955mil) TOP LAYER
Via (2992.7mil,908.66mil) TOP LAYER to BOTTOM LAYER Pad C93-1(2980mil,955mil) TOP LAYER
Via (3043.26mil,909.53mil) TOP LAYER to BOTTOM LAYER Pad C93-2(3060mil,955mil) TOP LAYER
Via (3292.99mil,1143.76mil) TOP LAYER to BOTTOM LAYER Pad C88-1(3260mil,1148.504mil) TOP LAYER
Via (3292.18mil,1201.26mil) TOP LAYER to BOTTOM LAYER Pad C88-2(3260mil,1211.496mil) TOP LAYER
Via (3291.59mil,1227.46mil) TOP LAYER to BOTTOM LAYER Pad C88-2(3260mil,1211.496mil) TOP LAYER
Via (2089.51mil,2612.45mil) TOP LAYER to BOTTOM LAYER Pad C31-2(2050mil,2625mil) TOP LAYER
Via (1066.54mil,2907.67mil) TOP LAYER to BOTTOM LAYER Pad R103-1(1096.378mil,2910mil) TOP LAYER
Via (901.43mil,2783.39mil) TOP LAYER to BOTTOM LAYER Pad R101-1(901.378mil,2810mil) TOP LAYER
Via (3368.07mil,1853.31mil) TOP LAYER to BOTTOM LAYER Pad C78-1(3335mil,1853.504mil) TOP LAYER
Via (3303.29mil,1855.54mil) TOP LAYER to BOTTOM LAYER Pad C78-1(3335mil,1853.504mil) TOP LAYER
Via (3367.08mil,1931.73mil) TOP LAYER to BOTTOM LAYER Pad C78-2(3335mil,1916.496mil) TOP LAYER
Via (3367.08mil,1906.72mil) TOP LAYER to BOTTOM LAYER Pad C78-2(3335mil,1916.496mil) TOP LAYER
Via (2701.24mil,1592.64mil) TOP LAYER to BOTTOM LAYER Pad C76-1(2655mil,1610mil) TOP LAYER
Via (2609.14mil,1526.51mil) TOP LAYER to BOTTOM LAYER Pad C76-2(2655mil,1530mil) TOP LAYER
Via (2701.46mil,1507.37mil) TOP LAYER to BOTTOM LAYER Pad C76-2(2655mil,1530mil) TOP LAYER
Via (2602.45mil,1344.9mil) TOP LAYER to BOTTOM LAYER Pad C73-2(2565mil,1325mil) TOP LAYER
Via (2554.73mil,1625.34mil) TOP LAYER to BOTTOM LAYER Pad C72-2(2565mil,1580mil) TOP LAYER
Via (2582.98mil,1625.1mil) TOP LAYER to BOTTOM LAYER Pad C72-2(2565mil,1580mil) TOP LAYER
Via (3100.78mil,249.51mil) TOP LAYER to BOTTOM LAYER Pad C9-2(3055mil,240mil) TOP LAYER
Via (3100.25mil,223.73mil) TOP LAYER to BOTTOM LAYER Pad C9-2(3055mil,240mil) TOP LAYER
Via (3512.4mil,3611.77mil) TOP LAYER to BOTTOM LAYER Pad C12-2(3480mil,3611.496mil) TOP LAYER
Via (717.43mil,3393.23mil) TOP LAYER to BOTTOM LAYER Pad C14-2(685mil,3391.496mil) TOP LAYER
Via (370.52mil,2692.09mil) TOP LAYER to BOTTOM LAYER Pad C19-2(383.66mil,2645.63mil) TOP LAYER
Via (316.12mil,2419.59mil) TOP LAYER to BOTTOM LAYER Pad C20-2(303.51mil,2373.96mil) TOP LAYER
Via (2243.04mil,2740.78mil) TOP LAYER to BOTTOM LAYER Pad C26-1(2275mil,2738.504mil) TOP LAYER
Via (2306.73mil,2740.48mil) TOP LAYER to BOTTOM LAYER Pad C26-1(2275mil,2738.504mil) TOP LAYER
Via (2307.53mil,2817.94mil) TOP LAYER to BOTTOM LAYER Pad C26-2(2275mil,2801.496mil) TOP LAYER
Via (2307.46mil,2793.51mil) TOP LAYER to BOTTOM LAYER Pad C26-2(2275mil,2801.496mil) TOP LAYER
Via (3106.73mil,2815.6mil) TOP LAYER to BOTTOM LAYER Pad C36-2(3075mil,2796.496mil) TOP LAYER
Via (3106.5mil,2788.91mil) TOP LAYER to BOTTOM LAYER Pad C36-2(3075mil,2796.496mil) TOP LAYER
Via (2904.81mil,2646.62mil) TOP LAYER to BOTTOM LAYER Pad C41-2(2865mil,2625mil) TOP LAYER
Via (2904.42mil,2621.89mil) TOP LAYER to BOTTOM LAYER Pad C41-2(2865mil,2625mil) TOP LAYER
Via (2794.18mil,2737.91mil) TOP LAYER to BOTTOM LAYER Pad C43-1(2794.744mil,2705.76mil) TOP LAYER
Via (3150mil,2300mil) TOP LAYER to BOTTOM LAYER Pad C45-1(3140mil,2333.504mil) TOP LAYER
Via (1521.36mil,1754.05mil) TOP LAYER to BOTTOM LAYER Pad C49-1(1520mil,1800mil) TOP LAYER
Via (640.46mil,1672.95mil) TOP LAYER to BOTTOM LAYER Pad C52-1(641.496mil,1705mil) TOP LAYER
Via (640.23mil,1737.31mil) TOP LAYER to BOTTOM LAYER Pad C52-1(641.496mil,1705mil) TOP LAYER
Via (545.3mil,1700.32mil) TOP LAYER to BOTTOM LAYER Pad C52-2(578.504mil,1705mil) TOP LAYER
Via (544.59mil,1726.38mil) TOP LAYER to BOTTOM LAYER Pad C52-2(578.504mil,1705mil) TOP LAYER
Via (1728.15mil,1698.65mil) TOP LAYER to BOTTOM LAYER Pad C62-1(1726.496mil,1730mil) TOP LAYER
Via (1650.71mil,1762.55mil) TOP LAYER to BOTTOM LAYER Pad C62-2(1663.504mil,1730mil) TOP LAYER
Via (1674.2mil,1762.15mil) TOP LAYER to BOTTOM LAYER Pad C62-2(1663.504mil,1730mil) TOP LAYER
Via (820.65mil,1587.24mil) TOP LAYER to BOTTOM LAYER Pad U3-1(828.504mil,1609.882mil) TOP LAYER
Via (1956.68mil,1657.58mil) TOP LAYER to BOTTOM LAYER Pad U4-5(1946.496mil,1679.567mil) TOP LAYER
Via (907.48mil,2621.85mil) TOP LAYER to BOTTOM LAYER Pad U7-1(929.882mil,2611.496mil) TOP LAYER
Via (1143.5mil,2829.3mil) TOP LAYER to BOTTOM LAYER Pad R100-1(1143.622mil,2855mil) TOP LAYER
Via (993.05mil,2882.33mil) TOP LAYER to BOTTOM LAYER Pad C102-2(1025mil,2866.496mil) TOP LAYER
Via (993.64mil,2860.21mil) TOP LAYER to BOTTOM LAYER Pad C102-2(1025mil,2866.496mil) TOP LAYER
Via (3137.9mil,2488.83mil) TOP LAYER to BOTTOM LAYER Pad U2-11(3120.118mil,2503.504mil) TOP LAYER
Via (2009.96mil,2339.47mil) TOP LAYER to BOTTOM LAYER Pad R35-1(2060mil,2367.087mil) BOTTOM LAYER
Via (2009.96mil,2389.58mil) TOP LAYER to BOTTOM LAYER Pad R35-1(2060mil,2367.087mil) BOTTOM LAYER
Via (1330.24mil,2943.1mil) TOP LAYER to BOTTOM LAYER Pad R114-1(1340mil,2913.622mil) BOTTOM LAYER
Via (1354.04mil,2943.52mil) TOP LAYER to BOTTOM LAYER Pad R114-1(1340mil,2913.622mil) BOTTOM LAYER
Via (2891.9mil,2276.37mil) TOP LAYER to BOTTOM LAYER Pad R45-2(2890mil,2237.913mil) BOTTOM LAYER
Via (837.86mil,2769.98mil) TOP LAYER to BOTTOM LAYER Pad R105-1(755mil,2744.921mil) BOTTOM LAYER
Via (837.86mil,2741.17mil) TOP LAYER to BOTTOM LAYER Pad R105-1(755mil,2744.921mil) BOTTOM LAYER
Via (1699.91mil,373.9mil) TOP LAYER to BOTTOM LAYER Pad R16-1(1700mil,408.504mil) BOTTOM LAYER
Via (2015.12mil,374.21mil) TOP LAYER to BOTTOM LAYER Pad R17-1(2015mil,408.504mil) BOTTOM LAYER
Via (2830.4mil,1394.39mil) TOP LAYER to BOTTOM LAYER Pad R111-2(2823.622mil,1370mil) BOTTOM LAYER
Via (2853.03mil,1320.1mil) TOP LAYER to BOTTOM LAYER Pad R112-1(2823.622mil,1320mil) BOTTOM LAYER
Via (2099.68mil,2926.78mil) TOP LAYER to BOTTOM LAYER Pad U13-1(2064.5mil,2927mil) BOTTOM LAYER
Via (1077.27mil,2144.69mil) TOP LAYER to BOTTOM LAYER Pad U23-4(1103mil,2144.5mil) BOTTOM LAYER
Via (1202.58mil,2035.03mil) TOP LAYER to BOTTOM LAYER Pad U23-1(1177mil,2035.5mil) BOTTOM LAYER
Via (3458.87mil,843.97mil) TOP LAYER to BOTTOM LAYER Pad U31-3(3450.5mil,817mil) BOTTOM LAYER
Via (708.2mil,2438.34mil) TOP LAYER to BOTTOM LAYER Pad U32-1(708mil,2404.5mil) BOTTOM LAYER
Via (3439mil,3081mil) TOP LAYER to BOTTOM LAYER Pad U33-3(3424.5mil,3108mil) BOTTOM LAYER
Via (993.64mil,2860.21mil) TOP LAYER to BOTTOM LAYER Via (993.05mil,2882.33mil) TOP LAYER to BOTTOM LAYER
Via (3168.16mil,1020.45mil) TOP LAYER to BOTTOM LAYER Via (3168.53mil,998.18mil) TOP LAYER to BOTTOM LAYER
Via (1562.91mil,1877.62mil) TOP LAYER to BOTTOM LAYER Via (1563.07mil,1900.58mil) TOP LAYER to BOTTOM LAYER
Back to top

Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All)
Height Constraint: SMT Small Component H5-1902E (3800mil,200mil) on BOTTOM LAYER
Height Constraint: SMT Small Component H6-1902E (200mil,3800mil) on BOTTOM LAYER
Height Constraint: SMT Small Component H7-1902E (200mil,200mil) on BOTTOM LAYER
Height Constraint: SMT Small Component H8-1902E (3800mil,3800mil) on BOTTOM LAYER
Back to top

Component Clearance Constraint ( Horizontal Gap = 10mil, Vertical Gap = 10mil ) (All),(All)
SMT Small Component R24-CRCW0603300RJNEA (3510mil,3140mil) on BOTTOM LAYER SOIC Component U33-TPS22929DDBV (3370mil,3145mil) on BOTTOM LAYER
SOIC Component U19-TPS22929DDBV (3310mil,2260mil) on BOTTOM LAYER SOIC Component U28-TPS22929DDBV (3340mil,2075mil) on BOTTOM LAYER
Back to top

Component Clearance Constraint ( Horizontal Gap = 25mil, Vertical Gap = Infinite ) (InComponentClass('Mounting Holes')),(All)
SMT Small Component H6-1902E (200mil,3800mil) on BOTTOM LAYER Small Component H1-NY PMS 440 0025 PH (200mil,3800mil) on TOP LAYER
SMT Small Component H8-1902E (3800mil,3800mil) on BOTTOM LAYER Small Component H2-NY PMS 440 0025 PH (3800mil,3800mil) on TOP LAYER
SMT Small Component H7-1902E (200mil,200mil) on BOTTOM LAYER Small Component H3-NY PMS 440 0025 PH (200mil,200mil) on TOP LAYER
SMT Small Component H5-1902E (3800mil,200mil) on BOTTOM LAYER Small Component H4-NY PMS 440 0025 PH (3800mil,200mil) on TOP LAYER
Back to top