Voltage translating gates

Voltage translation is a robust solution with the ability to reduce the number of parts for qualification and assembly. Board design is streamlined by obtaining the functionality of two devices in one. By limiting the number of devices on a board, designers can decrease potential points of failure on the board design.

Easily integrate systems and peripherals functioning at different logic levels with single supply voltage translation while taking advantage of the industry’s newest packages. Translation between 1.8-V to 5.5-V to further streamline system and decrease board space. TI’s voltage translation portfolio is capable of performing both up and down translation suitable for any application.

The SOT-23-Thin (DYY) package is the industry's smallest discrete logic leaded package measuring at 4.2 mm by 3.26 mm, which is 57% smaller than the TSSOP equivalent. With a standard 0.5 mm pitch, the DYY package easily integrates into the existing manufacturing equipment. The BQA package is TI's smallest 14-pin logic quad flat no-lead (QFN) package measuring at 3.0 mm by 2.5 mm, which is 76% smaller than the thin-shrink small-outline package (TSSOP) equivalent and 40% smaller than the previous-generation QFN package. This package also comes in wettable flank configurations to enable optical inspection as opposed to traditional X-ray inspection during manufacturing.

From left to right: SOT-23-Thin, TSSOP, SOIC, SSOP

With single-supply level-shifting, translate up to supply higher power perpherials from low power sources and translate down to integrate GPIO logic levels of all types. The wide voltage range supports systems with varied levels of logic coexisting including 1.8-V, 2.5-V, 3.3-V, and 5.0-V. This can also be used to integrate different type of logic levels such as CMOS and TTL.