To see our new Bare Die Solutions (TD) please go to www.ti.com/baredie

Electronic products and systems designed today are smaller and lighter, yet offer ever increasing functionality. Texas Instruments offers bare die/wafer solutions for applications that require higher levels of integration to reduce board space. TI can provide a wide range of products in bare die and wafer form. A variety of testing and qualification options are available based on product maturity and complexity, as well as customer requirements.

Texas Instruments Incorporated has expanded package options with the availability of bare die. With new small volume waffle pack quantities for Tested Die (TD) TI provides the capability to prototype bare die applications quickly without the need to purchase a full wafer. TI provides a wide range of products for sale in bare die, known good die and in wafer form.

TI offers three categories of bare die screening:

• Tested die (TD)
• Known Good Die (KGD)
• Commercial wafers

Feasibility assessments are conducted for each opportunity to assess unique requirements related to die sales. The assessment takes into account such factors as:

• Customer requirements (qualification, inspection, radiation expectations)
• End application
• Probe Solution (HW)
• Probe Test Coverage
• Packing options (wafer, waffle pack)
• Test Platform

For a list of our Bare Die products download the new guide.

View the Bare Die Roadmap.

Requesting Bare Die

To request creation of a bare die package please download and fill out the Die Request Form and email it to dierequest@list.ti.com.