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Templeton Envisions World with More Than One Billion High-speed Wireless
Subscribers
CANNES, FRANCE (Feb. 14, 2005) – Recent technology developments
could lead to massive global penetration of 3G mobile phones over the
next decade, said Rich Templeton, president and CEO of Texas Instruments
Incorporated (TI) (NYSE: TXN).
“It
is entirely possible that by 2015, more than 1 billion people will be
using 3G mobile phones or even more advanced handsets,” Templeton
said at a press event concurrent with the 3GSM World Congress. “We
see a world where 3G wireless eventually will be available everywhere,
to everyone – from the world’s major financial centers to
the farthest reaches of developing nations.”
Templeton noted that rural residents in developing countries already use
text messaging on mobile phones for convenience and commerce. “Adding
more advanced services can make an even bigger difference. For instance,
higher-resolution camera phones and multimedia messaging have great potential
for medical applications – linking villages with urban doctors who
can actually see what the problem is from a remote location,” he
said. “I think it’s a simple fact that the future of information
technology in the developing world can be held in your hand – it’s
the mobile phone.”
Templeton cautioned, however, that “We must be realistic because
there is a lot of hard work ahead and difficult obstacles to overcome
in this next wireless generation – from spectrum regulation to handset
pricing and power efficiency.”
Achieving 3G’s full potential will require intense collaboration
among handset manufacturers, network operators, regulators and wireless
applications developers. “It also will require foundational technology
that supports robust, yet affordable 3G handsets and infrastructure,”
he said.
TI is taking a comprehensive approach to the complex and wide-ranging
technology requirements of 3G handsets and networks. The company is building
on 15 years of experience in the wireless industry as well as TI’s
broad consumer electronics expertise, he said.
For handsets, Templeton cited TI’s new family of OMAP-VoxTM wireless
solutions. The new solutions, which were announced earlier in the day,
combine mobile-phone modems and multimedia applications processing in
a single product. This cost-effective approach will reduce development
time and foster the spread of 3G mobile phones to the global masses, he
said.
For network infrastructure, he highlighted TI’s new universal baseband
1 GHz DSP for wireless base stations. This single-chip breakthrough allows
operators to use one chip to support multiple 3G standards. “We’re
working with 9 of the top 10 base station manufacturers, and our new baseband
DSP will help operators be far more efficient and productive with their
capital deployments,” he said.
“In total, TI serves more than 50 percent of the UMTS marketplace,”
he said. UMTS stands for Universal Mobile Telecommunications System, a
3G wireless communications standard that builds on the globally predominant
GSM standard and incorporates the GSM, GPRS, EDGE and WCDMA wireless standards.
Templeton noted that several other recent TI innovations will support
the wireless industry’s growth and global penetration. For example,
TI is sampling a single-chip solution for mobile phones that will accelerate
wireless penetration by enabling low-cost mobile phones in places such
as China, India and Latin America. “Hundreds of millions of people
could experience telecommunications for the first time because of this
single-chip breakthrough,” Templeton said.
He also highlighted TI’s single-chip solution for live digital broadcast
TV on mobile phones. Also, the company’s OMAP 2 processors will
enable mobile phones with multi-megapixel cameras, digital video recorders,
CD-quality audio, 3D multiplayer gaming and more.
“TI’s objective is to help operators and manufacturers put
real power into the hands of their customers – billions of customers
worldwide,” Templeton said. “I have no doubt that we will
see things result from this that none of us can imagine today. The possibilities
are endless.”
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Texas Instruments
Incorporated provides innovative DSP and analog technologies to meet our
customers’ real world signal processing requirements. In addition
to Semiconductor, the company’s businesses include Sensors &
Controls and Education Technology. TI is headquartered
in Dallas, Texas, and has manufacturing, design or sales operations in
more than 25 countries.
Texas Instruments is traded on the New York Stock Exchange under the symbol
TXN. More information is located on the World Wide Web at www.ti.com.
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