|
Two common attributes of interest to semiconductor users are the intrinsic (or constant) Failure Rate and the Flammability rating of a device.
The intrinsic Failure Rate is an estimate based on data taken from High-Temperature Life Test on representative product families. A statistical confidence limit is applied based on a Chi-Squared failure distribution. The most common expressions for this data are in terms of Mean Time Between Failures (MTBF)/Failures-In-Time (FITs) for long term failure rates, and Defective Parts Per Million (DPPM) for early life failure rates.
Flammability rating is an Underwriters Laboratory (U.L.) measure of the ability of the plastic epoxies in the package to resist catching fire and the ability of the material to self-extinguish when exposed to flame or high heat.
|
Samples & Purchase Cart
