Policies & Procedures: Qualification Process

The Qualification Process is the method by which we confirm that the reliability of our designs, processes, products and packages exceeds the expectations of our customers.

Test environments are used to accelerate typical field failure mechanisms so that failures occur within minimal stress times. TI recognizes the importance of verifying that failures are representative of those found in the application and are not artifacts of the stress itself.

Acceleration factors are developed for each test to ensure that the duration of the test is sufficient to address the end use of the device.

Qualification tests are generally done in package form, and are complimented wherever possible with Wafer Level Reliability tests to predict the onset of wearout. Typical tests used are High Temperature Operating Life (Dynamic or Steady-State), High Temperature Bake, Temperature Cycling, Thermal Shock, Temperature Humidity Bias or HAST, and Unbiased HAST or Autoclave.