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1. What is driving the need to be Pb-Free and Green?
Due to environmental concerns, the need for environmentally-friendly solutions in electronic components and systems is receiving increasing attention within the semiconductor and electronics industries. The European Union (EU) has adopted the RoHS (Restrictions on the Use of Certain Hazardous Substances) and the WEEE (Waste Electrical and Electronic Equipment) Directives. Effective July 1, 2006, RoHS bans the use of certain materials, such as lead, mercury and cadmium, in electronics sold in Europe. WEEE requires any company that sells their electronics products in Europe to set up collection and recycling systems for these goods by August 13, 2005. Similar laws have been adopted in California, Maine and in China.
2. How does TI define “Pb-Free” and “Green”?
Pb-Free: TI defines "Pb-Free" or "RoHS Compliant" to mean semiconductor products that are compliant with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials unless exempt. Where designed to be soldered at high temperatures, TI "Pb-Free" and "RoHS Compliant" products are suitable for use in specified lead-free processes.
Green: In addition to the RoHS substances, TI is addressing additional substances of concern through our "Green" mold compound initiative. TI defines "Green" to mean Pb-Free/RoHS Compliant, and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
3. Are TI’s Pb-Free devices rated for high temperature soldering processes?
Yes. Typically, lead-free solders reflow in the +235C to +245C range with peak reflow process temperatures in the range of +250C to +260C. TI´s Pb-Free devices are rated for this high temperature lead-Free reflow environment and will be shipped with labels showing the device´s peak temperature rating (see Q11 for additional label information).
4. What is the material content of the devices I procure from TI?
TI provides a product content web site available to customers that allows anyone to enter either a TI part number or a customer specific part number (where that number has been registered with TI) and obtain the complete material content, with weights and parts-per-million percentages of the substances contained in the homogeneous materials. TI is actively populating the database, but the majority of product content information is available today. Please go to:
http://www.ti.com/productcontent.
5. How can I find out if a specific TI device is Pb-Free or Green, or when it will be?
In addition to the material content information described in question 4, the TI product content website shows the current production status, including moisture level, reflow temperature qualified at, package finish, and Pb-Free and Green status of individual parts. This same tool provides planned conversion dates for products that are not yet Pb-Free or Green. TI is actively populating the database, but the majority of product content information is available today. The web site is at:
http://www.ti.com/productcontent.
6. Will Pb-Free or Green devices be more expensive than Pb-based devices?
Conversion to Pb-Free or Green, in and of itself, did not result in price changes, provided customers purchase the TI standard offering (flip-chip devices TBD).
7. If a device is converted to Pb-Free, will TI continue to supply the Pb-based part?
TI divides up parts into those that are completely compatible with both Pb and lead-free based solders and soldering temperatures and those that are not compatible. Most TI leadframe based packages utilize Nickel-Palladium-Gold (NiPdAu) finishes. This finish is not solder dipped, and thus is fully compatible with current Pb-based solders and reflow temperatures, and newer lead-free solders with their higher reflow temperatures. TI has been supplying these parts for over 10 years and has shipped billions of parts with this finish. Although compatible with RoHS thresholds for over a decade, many of these products had not been certified for high temperature reflow (250C-260C). TI is converting the remainder of its leadframe based packages to NiPdAu and qualifying all of them for high temp reflow. Once converted/qualified, TI plans to offer only one version of these products, which is qualified for both Pb-free and lPb-based solders. A limited number of products may initially only be available with a matte-Tin (Sn) finish. Plans to convert to NiPdAu are in development for these products.
Most area array products, like TI’s Ball Grid Array (BGA) packages utilize solder balls as the terminal. Conventional Tin-Lead (SnPb) solders are not compatible with lead-free solder balls on BGA’s (typically Tin-Silver-Copper SnAgCu). TI is supplying both SnPb solder ball BGA packages and SnAgCu solder ball BGA packages and will continue to do so based on customer/market demand.
8. Is TI going to convert all products to Pb-Free and Green?
Based on technical feasibility, demand and/or application, some small percentage of products may not be converted. Please contact your local sales representative if you have any questions about conversion of particular parts that is not provided on TI’s product content website at http://www.ti.com/productcontent.
9. Will TI change part numbers?
TI is adding Pb-Free part numbers when the Pb-Free version of the standard part becomes available. The Pb-Free BGA based part numbers will have a "Z" in the package suffix (i.e. OPA2347YZDR) and the Pb-Free leadframe based part numbers will have a 2-character JEDEC based suffix added to the standard part number (i.e. TLC556CDRG4).
The flip-chip BGAs with a "Z" in the package suffix use lead-free solder balls but contain lead in the solder bumps used between the die & package substrate - these flip-chip BGAs are "RoHS Exempt" and their box labels will say "RoHS Exempt". The flip-chip BGAs that are 100% lead-free will have a "C" in the package suffix.
10. Will TI part marking change?
Space permitting, the devices themselves will be marked with the JEDEC based E-Cat code. Devices will be marked as each assembly site conversion and symbolization capability is confirmed.
11. Will TI packing labels change?
TI has been providing the JEDEC lead-free logo on packing labels to indicate Pb-Free parts since 2004. The labels also specify the MSL rating information and the temperature capability of parts that utilize a lead-free finish and are rated for a lead-free high-temp reflow environment.
In addition, TI has been providing JEDEC based E-Cat symbols on labels from specified assembly test sites since July 2004. As assembly sites are converted, the JEDEC based E-Cat symbols will appear in the 1D & 2D barcodes on all shipping labels. See http://www.ti.com/ecoinfo for TI’s position statement which provides an example packing label.
12. How has TI been notifying customers?
TI has been notifying customers of Pb-Free conversions and availability through standard Product Change Notices (PCN). Each PCN listed the devices being converted and the planned effective date of conversion.
13. In what way would a Pb-Free or Green device influence my board’s functionalities or my application?
None expected. TI has been shipping devices compatible with RoHS thresholds for over 10 years. TI’s testing of Pb-Free devices indicates that changes to performance or datasheets are not expected. Customers should always refer to the TI Datasheet for product performance specifications.
14. Did product MSL levels change?
a. Initially, some products were re-classified at the higher reflow temperatures and their Moisture Sensitivity Levels (MSL) did degrade. However, most of these products were later migrated to Green mold compounds, resulting in a return to their prior MSL rating.
b. The MSL a product is qualified at is printed on the shipping label and is available at the TI website www.ti.com/productcontent.
c. If a product is classified at a higher MSL at high temp solder reflow temperatures, it still remains qualified at the older/lower MSL at the lower reflow temperatures. This is why TI shipping labels will often show two MSLs and reflow temperatures.
d. Customers who have not changed their assembly processes to switch to lead-free solders and fluxes can use the fully compatible TI leadframe package products without change to assembly setups.
e. Customers who have not changed their assembly process to switch to lead-free solders and fluxes should not use TI’s Pb-Free BGA packages as this combination is not compatible.
15. Are TI Pb-Free parts compatible with a Pb-based soldering process?
TI divides up parts into those that are completely compatible with both Pb and lead-free based solders and soldering temperatures and those that are not compatible. Most TI leadframe based packages utilize Nickel-Palladium-Gold (NiPdAu) finishes and Green mold compounds. This finish & mold compound is fully compatible with current Pb-based solders and reflow temperatures, and newer lead-free solders with their higher reflow temperatures. A limited number of products may initially only be available with a matte-Tin (Sn) finish, which is also compatible with Pb-based soldering processes. Plans to convert to NiPdAu are in development for these products.
Most area array products, like TI’s Ball Grid Array (BGA) packages utilize solder balls as the terminal. Conventional Tin-Lead (SnPb) solders are not compatible with lead-free solder balls on BGA’s (typically Tin-Silver-Copper SnAgCu). TI is supplying both SnPb solder ball BGA packages and SnAgCu (lead-free) solder ball BGA packages and will continue to do so based on customer/market demand.
16. Where can I get qualification data?
TI provides the qualification data, as well as the material content data, with every Product Change Notice.
17. Will Pb-Free data be located in each device product folder on TI’s website (http://www.ti.com)
TI strives to provide as much product detail as possible on the website in our product folders. This includes Pb-Free and Green status. Some detailed data may not appear directly in the product folder, but will be accessible directly from the product folder or by using the Pb-Free Search Tool found at www.ti.com/productcontent. In addition, TI will provide access to device Quality information via search in the Quality section of TI.com (http://www.ti.com/ecoinfo).
18. Who can I contact for questions relating to Pb-Free?
a. Customer surveys or requests for information inquiring on the status of Pb-Free/Green products may be submitted to ezSurveys@list.ti.com for completion. Customers may also utilize the information search tool on TI’s product content website at: http://www.ti.com/productcontent or obtain general information about TI’s Pb-Free and Green Initiatives at http://www.ti.com/ecoinfo.
b. For any other questions regarding TI’s Pb-Free status or strategy please contact your local sales representative.
Important Warranty and Disclaimer Information: The information provided on this page represents TI´s knowledge and belief as of the date that it is provided.TI bases its material content knowledge on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information, but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. TI provides an exclusive warranty for certain material content representations in the Material Declaration Certificate for Semiconductor Products, which can be found at www.ti.com/leadfree. All other material content information is provided “as is.”
For additional information, please contact Product Information Center.
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