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TI Home > Support > Quality & Eco-Info > Eco-Info & Lead (Pb)-Free > Lead-free (Pb-free) > Pb-Free Package Roadmap

Eco-Info & Lead-free (Pb-free): Texas Instruments Lead (Pb)-Free/Green Package Roadmap

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Lead-free (Pb-free)/Green Package Roadmap
  Lead-free (Pb-free) Finish + 260C + Green Mold Compound
Package Type Terminal Finish PCN Completed Conversion Completed PCN Completed Conversion Completed
MicroStar BGA (0.8mm pitch) SnAgCu1 No PCN issued2,4 2Q 20032 2Q 2004 4Q 20042
MicroStar BGA (< 0.8mm pitch) SnAgCu1 No PCN issued2,4 2Q 20032 2Q 2004 4Q 20032
MicroStar Jr SnAgCu1 No PCN issued2,4 2Q 20032 No PCN issued2,4 4Q 20042
PBGA SnAgCu No PCN issued2,4 4Q 20042 TBD TBD
SOIC / SOP / SSOP NiPdAu 2Q 20043 1Q 2005 2Q 2004 1Q 2005
TSSOP / TVSOP NiPdAu 2Q 2004 1Q 2005 2Q 2004 1Q 2005
SC70 / SOT23 NiPdAu 2Q 2004 1Q 2005 2Q 2004 1Q 2005
SOT223 / TSOT NiPdAu 1Q 2004 1Q 2005 1Q 2004 1Q 2005
PowerPAD NiPdAu 4Q 20034 1Q 20054 4Q 20034 1Q 20054
SIP Matte Sn 1Q 2004 2Q 2004 1Q 2004 2Q 2004
MSOP NiPdAu 2Q 2004 4Q 2004 2Q 2004 4Q 2004
PLCC Matte Sn 4Q 2004 4Q 2004 TBD TBD
QFN NiPdAu 2Q 2004 4Q 2004 2Q 2004 4Q 2004
QSOP NiPdAu 1Q 2004 2Q 2004 1Q 2004 2Q 2004
TO-220 Matte Sn 1Q 2004 4Q 2004 4Q 2004 4Q 2004
TQFP / LQFP NiPdAu 4Q 2004 1Q 2005 4Q 2004 1Q 2005

 

Please note that not all TI devices in a particular package style will be converted to the Lead-free (Pb-free) finish or green material set at the timing indicated. Please use the Pb-Free Search Tool found at www.ti.com/productcontent for part number specific conversion details or contact the TI ezSurveys team (ezsurveys@list.ti.com). Conversions are being managed by assembly site. Multiple PCNs are being issued by site.

Specific Notes:
  1. Specific alloys for Pb-Free solder balls used can be provided upon request.
  2. Pb-Free ball packages will be setup with new parts numbers, different from the part numbers for existing SnPb ball options.
  3. Initial PCN indicated peak reflow rating of 250C (per J-STD-020B) but most devices in this category have been upgraded to 260C peak reflow.
  4. Conversion to new material sets will be driven by customer demand.