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TI Home > Support > Quality & Eco-Info > Eco-Info & Lead (Pb)-Free > Lead-free (Pb-free) > Palladium Lead Finish

Eco-Info & Lead-free (Pb-free): Palladium Lead Finish

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In 1989, Texas Instruments introduced a revolutionary new lead finish into the Semiconductor industry. This plating technology consists of a copper base metal plated with nickel and palladium. The palladium acts as an oxidation barrier for the nickel which is the actual soldering surface. This palladium leadframe technology has replaced Sn/Pb coating for the majority of TI logic and linear devices.
 

Steam Age Evaluation for Palladium Finish ICs (pdf)

Shelf Life Evaluation for Palladium ICs (pdf)

Pb-Free Solder Joint Evaluation (pdf)

Evaluation of Water Soluble and No-Clean Solder Pastes with Palladium Plated and Solder Plated SMT Devices (pdf)