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On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" directive 2002/95/EC, which has an implementation date of July 1, 2006. TI completed most of its component conversions roughly a year ahead of this deadline and will continue to monitor and respond to other environmental directive developments to ensure our customer needs are met in a timely manner.
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Lead-Free Conversion Overview
Small amounts of lead have been commonly used in integrated circuits for many years. During the late 1980s, TI began an initiative to convert its products to lead-free alternatives.
Today, TI's integrated circuits meet the RoHS thresholds for cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs). Most of our integrated circuits also meet the threshold for lead. For more information on specific packages or part numbers visit our Lead-free (Pb-free) page.
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Lead-free (Pb-free) Logo
After June 1, 2004, TI began shipping Pb-Free capable integrated circuit (IC) components using packing labels that align with Joint Electronic Device Engineering Council (JEDEC) standards. TI began using a Pb-Free logo on packing labels in 2003 for devices that utilize both a Pb-Free finish and a material set rated for use in lead-free reflow processes. TI's new JEDEC-compliant label will continue to reflect these markings for applicable devices.
Example of TI's JEDEC-compliant packing label with the Lead-free (Pb-free) logo and MSL rating
Packing Labels with a Pb-Free logo are compatible with the RoHS thresholds for all substances, including lead (Pb). For additional information related to Pb-Free labeling and symbolization, see more Pb-Free Logo Details.
TI products that are "Pb-free" or "Green" are fully RoHS compliant to known regulations such as defined by the European Union, China and California. Starting 21 July 2007, TI is implementing the chasing arrow symbol on the product labels. This will help clarify with customers whether TI products contain RoHS materials above the maximum concentrations value (MCV) or not. This symbol would appear on the label seen above as:
Further details of the chasing arrow symbol used on labels can be found at Chasing Arrows PCN 20070518001 Details. Background information for the environmentally friendly use period statement for products containing RoHS materials above the MCV and China RoHS can be found at China RoHS and Chasing Arrow Information.
The table below reflects a substance list with corresponding information about TI's RoHS compatibility status.
| RoHS Substance List and TI Status |
| Substance |
Threshold |
Status of TI's Integrated Circuits |
Documents |
| Lead |
1000ppm of homogeneous material |
Most are below threshold, check product content by device name: www.ti.com/productcontent |
Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide |
| European Commission proposed amendment to RoHS issued December 2003; 1000 ppm homogeneous material threshold. |
| Cadmium |
75ppm of total weight*
100ppm of homogeneous material |
Below threshold, trace impurity in BGA solder balls |
Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide: threshold = 75ppm* |
| European Commission proposed amendment to RoHS issued December 2003; 100 ppm homogeneous material threshold. |
| Mercury |
1000ppm of homogeneous material |
Not used |
Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide |
| European Commission proposed amendment to RoHS issued December 2003; 1000 ppm homogeneous material threshold. |
| Hexavalent Chromium |
1000ppm of homogeneous material |
Not used |
Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide |
| European Commission proposed amendment to RoHS issued December 2003; 1000 ppm homogeneous material threshold. |
| Polybrominated biphenyls (PBB) |
1000ppm of homogeneous material |
Not used |
Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide |
| European Commission proposed amendment to RoHS issued December 2003; 1000 ppm homogeneous material threshold. |
| Polybrominated diphenyl ethers (PBDE) |
1000ppm of homogeneous material |
Not used |
Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide |
| European Commission proposed amendment to RoHS issued December 2003; 1000 ppm homogeneous material threshold. |
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* Current documents conflict on threshold allowable. TI is compatible with the lower threshold.
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Green Conversion
In addition to the RoHS substances, TI is addressing additional substances of concern through our "Green" mold compound initiative. TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). A more complete statement can be found at this link.
Today, Br and Sb are key components of the flame retardant systems in most IC molding compounds used by the Semiconductor industry, including TI. In response to environmental concerns, most mold compound suppliers began formulating Green mold compounds with alternative flame retardant systems several years ago. TI began green conversions in 2004 with most conversions completed by the end of 2005. To check the Green status of a specific part number, use the Product Content tool found at www.ti.com/productcontent.
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Statement on Registration, Evaluation, Authorization of Chemicals (REACH)
To ensure a common approach toward the legal obligations and timelines under REACH, global semiconductor device manufacturers are in the process of developing a clear common statement concerning REACH and its impact on the semiconductor industry. Texas Instruments Incorporated (TI) has participated in the development of this common understanding and has been preparing both our company and our supply chain for the requirements under REACH. In conjunction with others in the industry we are actively monitoring the specifics of the REACH requirements as they are developed by the regulators and how such requirements apply to our operations. The linked TI REACH document outlines the current understanding of semiconductor manufacturing companies on (pre-)registration, notification of substances of very high concern in articles and disclosure of information obligations we believe will arise under REACH as well as TI's actions to appropriately address such requirements.
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Evaluation Modules (EVMs) / Evaluation Boards and Kits
EVMs, board and kits intended for the use for Engineering, Development, Demonstration or Evaluation purposes only are not considered by TI to be finished end-products fit for general consumer use. These types of products are outside of the RoHS/WEEE requirements and therefore no RoHS status or reports are provided for these products. The linked EVM statement provides the detailed document that accompanies all EVM types of products shipped from Texas Instruments.
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Other substances of concern
Decabromodiphenyl ether (DecaBDE): As of June 30, 2008 the Decabromodiphenyl ether (DecaBDE) exemption referenced in the European Commission Decision of 13 October 2005 (2005/717/EC), will no longer be valid as a EU RoHS exemption. In response to the removal of this exemption, Texas Instruments (TI) would like to convey to its customers that TI integrated circuits do not contain DecaBDE. Full statement is located by selecting DecaBDE.
Dimethyl Fumarate (DMF): TI has investigated production materials and has determined that Dimethyl Fumarate CAS # 624-49-7 and Einecs No 210-849-0 is not used and is not present in our Integrated Circuits. Additionally, it is not used in moisture absorbent pillows accompanying TI's products. Full statement is located by selecting DMF.
Perfluorooctane sulfonates (PFOS): TI semiconductor products do not contain as intentional additives perfluorooctane sulfonates (PFOS) as identified in EU Directive 2006/122/EC (30th amendment to EU Directive 76/769/EEC). Full statement is located by selecting PFOS.
Red Phosphorous: TI does not supply IC components that use a mold compound containing inorganic (red) phosphorous as an alternative flame retardant system. Full statement is located by selecting Red Phosphorous.
Should you have further questions about this program, please contact your local TI Representative.
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