Eco-Info & Lead-free (Pb-free): Position Statement

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On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" directive 2002/95/EC, which has an implementation date of July 1, 2006. TI completed most of its component conversions roughly a year ahead of this deadline and will continue to monitor and respond to other environmental directive developments to ensure our customer needs are met in a timely manner.

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Statement on Registration, Evaluation, Authorization of Chemicals (REACH)

To ensure a common approach toward the legal obligations and timelines under REACH, global semiconductor device manufacturers are in the process of developing a clear common statement concerning REACH and its impact on the semiconductor industry. Texas Instruments Incorporated (TI) has participated in the development of this common understanding and has been preparing both our company and our supply chain for the requirements under REACH. In conjunction with others in the industry we are actively monitoring the specifics of the REACH requirements as they are developed by the regulators and how such requirements apply to our operations. The linked TI REACH document outlines the current understanding of semiconductor manufacturing companies on (pre-)registration, notification of substances of very high concern in articles and disclosure of information obligations we believe will arise under REACH as well as TI's actions to appropriately address such requirements.

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Cobalt Dichloride within Humidity Indicator Cards (HIC)

TI does not currently use Humidity Indicator Cards that contain Cobalt Dichloride. Some product packaged prior to the change that is stored in a warehouses may still contain a cobalt dichloride. If the warehouse is owned and operated by Texas Instruments, product packaging containing Cobalt Dichloride HIC's are labeled to notify the user of the presence of the chemical at 0.15%. Cobalt Dichloride white paper.

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European Union End of Life Vehicle (EU ELV)

The EU ELV 2000/53/EC directive released on 18 September 2000 restricted the use of 4 heavy metals, Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr6+) and Cadmium (Cd) in vehicles. The amending document 2002/525/EC released 27 January 2003 provided maximum concentration values of 1000ppm for Pb, Hg, Cr6+ and 100ppm for Cd. TI IC products listed by TI as "Pb-free" or "Green" meet the ELV requirements without the use of any exemptions.

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Lead-Free Conversion Overview

Small amounts of lead have been commonly used in integrated circuits for many years. During the late 1980s, TI began an initiative to convert its products to lead-free alternatives.

Today, TI's integrated circuits meet the RoHS thresholds for cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs). Most of our integrated circuits also meet the threshold for lead. For more information on specific packages or part numbers visit our Lead-free (Pb-free) page.

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Lead-free (Pb-free) Logo

After June 1, 2004, TI began shipping Pb-Free capable integrated circuit (IC) components using packing labels that align with Joint Electronic Device Engineering Council (JEDEC) standards. TI began using a Pb-Free logo on packing labels in 2003 for devices that utilize both a Pb-Free finish and a material set rated for use in lead-free reflow processes. TI's new JEDEC-compliant label will continue to reflect these markings for applicable devices.

Example of TI's JEDEC-compliant packing label with the Lead-free (Pb-free) logo and MSL rating

Lead (Pb) Free Logo and MSL Rating

Packing Labels with a Pb-Free logo are compatible with the RoHS thresholds for all substances, including lead (Pb). For additional information related to Pb-Free labeling and symbolization, see more Pb-Free Logo Details.

TI products that are "Pb-free" or "Green" are fully RoHS compliant to known regulations such as defined by the European Union, China and California. Starting 21 July 2007, TI is implementing the chasing arrow symbol on the product labels. This will help clarify with customers whether TI products contain RoHS materials above the maximum concentrations value (MCV) or not. This symbol would appear on the label seen above as:

Lead (Pb) Free Logo with Chasing Arrow Symbol

Further details of the chasing arrow symbol used on labels can be found at Chasing Arrows PCN 20070518001 Details. Background information for the environmentally friendly use period statement for products containing RoHS materials above the MCV and China RoHS can be found at China RoHS and Chasing Arrow Information.

The table below reflects a substance list with corresponding information about TI's RoHS compatibility status.

RoHS Substance List and TI Status
Substance Threshold Status of TI's Integrated Circuits Documents
Lead 1000ppm of homogeneous material Most are below threshold, check product content by device name: www.ti.com/productcontent Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide
European Commission proposed amendment to RoHS issued December 2003; 1000 ppm homogeneous material threshold.
Cadmium 75ppm of total weight*
100ppm of homogeneous material
Below threshold, trace impurity in BGA solder balls Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide: threshold = 75ppm*
European Commission proposed amendment to RoHS issued December 2003; 100 ppm homogeneous material threshold.
Mercury 1000ppm of homogeneous material Not used Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide
European Commission proposed amendment to RoHS issued December 2003; 1000 ppm homogeneous material threshold.
Hexavalent Chromium 1000ppm of homogeneous material Not used Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide
European Commission proposed amendment to RoHS issued December 2003; 1000 ppm homogeneous material threshold.
Polybrominated biphenyls (PBB) 1000ppm of homogeneous material Not used Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide
European Commission proposed amendment to RoHS issued December 2003; 1000 ppm homogeneous material threshold.
Polybrominated diphenyl ethers (PBDE) 1000ppm of homogeneous material Not used Joint EIA/EICTA/JGPSSI Industry Material Composition Declaration Guide
European Commission proposed amendment to RoHS issued December 2003; 1000 ppm homogeneous material threshold.

* Current documents conflict on threshold allowable. TI is compatible with the lower threshold.

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Green Conversion and Low Hologen Status

In addition to the RoHS substances, TI is addressing additional substances of concern through our "Green" mold compound initiative. TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). A more complete statement can be found in the Halogen's document.

Today, Br and Sb are key components of the flame retardant systems in most IC molding compounds used by the Semiconductor industry, including TI. In response to environmental concerns, most mold compound suppliers began formulating Green mold compounds with alternative flame retardant systems several years ago. TI began green conversions in 2004 with most conversions completed by the end of 2005. To check the Green status of a specific part number, use the Product Content tool found at www.ti.com/productcontent.

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Statement on Registration, Evaluation, Authorization of Chemicals (REACH)

To ensure a common approach toward the legal obligations and timelines under REACH, global semiconductor device manufacturers are in the process of developing a clear common statement concerning REACH and its impact on the semiconductor industry. Texas Instruments Incorporated (TI) has participated in the development of this common understanding and has been preparing both our company and our supply chain for the requirements under REACH. In conjunction with others in the industry we are actively monitoring the specifics of the REACH requirements as they are developed by the regulators and how such requirements apply to our operations. The linked TI REACH document outlines the current understanding of semiconductor manufacturing companies on (pre-)registration, notification of substances of very high concern in articles and disclosure of information obligations we believe will arise under REACH as well as TI's actions to appropriately address such requirements.

European Union End of Life Vehicle (EU ELV)
The EU ELV 2000/53/EC directive released on 18 September 2000 restricted the use of 4 heavy metals, Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr6+) and Cadmium (Cd) in vehicles. The amending document 2002/525/EC released 27 January 2003 provided maximum concentration values of 1000ppm for Pb, Hg, Cr6+ and 100ppm for Cd. TI IC products listed by TI as "Pb-free" or "Green" meet the ELV requirements without the use of any exemptions.

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Conflict Minerals Statement

TI has received several inquiries from our customers regarding TI's actions in response to the Conflict Minerals issue addressed in the Dodd-Frank Wall Street Reform and Consumer Protection Act that was passed by US Congress on July 2010. Although the regulations will not be issued until April 2011, TI has already begun working with industry groups and our direct suppliers to ensure that our customers will not experience any supply interruptions from this activity.

TI uses Tungsten, Tantalum, Tin and Gold in most of our semiconductor devices. Each of these metals has specific electrical properties which are necessary for the function of our products.

TI does not purchase these metals directly from smelters or mines. We are working with our direct suppliers to understand their supply chain and determine the origin of these metals. Our suppliers have provided preliminary assurances that these metals are not sourced in the DRC, but these assurances have not been verified. We have not yet identified the smelters used by each of our direct suppliers of these metals.

TI has been working with the EICC/GeSI Extractives Working Group to create industry agreed upon due diligence methods to use with our suppliers to ensure proper control of the sources of these metals and the ore from which they are extracted.

We are certain that when the electronics industry approves a credible due diligence practice and the regulations are finalized, more answers will be forthcoming. TI is looking forward to working with our customers to prove these methods to be reliable.

Conflict Minerals letter.

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EVM position statement

Evaluation modules/kits (EVMs) are intended to be used for Engineering, Development, Demonstration or Evaluation purposes only and are therefore not considered within the scope of the European Union directives regarding restricted substances (RoHS) and recycling (WEEE). EVMs are not considered finished products with a direct function as they require adjustments and connections to other electronic devices to function. They are designed for use in laboratory/development environments by professional engineers familiar with the proper handling of electrical components, including those with high voltage applications. The linked EVM statement provides the detailed document that accompanies all EVM types of products shipped from Texas Instruments.

Though EVMs are considered outside of the scope of EU material restriction requirements, starting with the Conversion Date, TI's EVM subcontractors have agreed to build EVM products with EU RoHS acceptable components and processes. Products that are shown with a "Y" under the "Available Supply" column have had all pre-conversion date inventories depleted and are EU RoHS compliant. Products that are shown with an "N" under the "Available Supply" column have pre-conversion date inventories left to be depleted and are therefore not EU RoHS compliant. Products with an "RoHS Exempt" under this column are EU RoHS exempt by using an applicable exemption(s).

To make the identification of RoHS compliant EVMs easier, TI will be phasing in the following symbolizations in 2 steps. The first is to provide labels on outer EVM packaging starting in August 2010. The second step will be to add this symbolization to the new releases of EVM printed circuit boards.

RoHS compliant products:

  1. Symbolization for no EU RoHS Exemptions required:
    • This pertains to products that are fully EU RoHS and China RoHS compliant and do not need any EU RoHS exemptions
  2. Symbolization with EU RoHS Exemption(s) required: RoHS Exempt
    • Product without the J-STD-060 symbol but state "RoHS Exempt" and use the China RoHS chasing arrow symbol is for product that has an EU RoHS exemption(s) being applied for lead (Pb)

Non RoHS compliant products:

Symbolization for Non RoHS Compliant symbolization:

  • Product without the J-STD-060 symbol and use the China RoHS chasing arrow symbol contain lead (Pb) above the 1000ppm threshold requirement and not under EU RoHS exemption.

Important Warranty and Disclaimer Information

TI bases its material content knowledge on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information, but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI provides an exclusive warranty for certain material content representations in the Material Declaration Certificate for Semiconductor Products, which can be found at www.ti.com/leadfree. All other material content information is provided "as is."

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Other substances of concern

Decabromodiphenyl ether (DecaBDE): As of June 30, 2008 the Decabromodiphenyl ether (DecaBDE) exemption referenced in the European Commission Decision of 13 October 2005 (2005/717/EC), will no longer be valid as a EU RoHS exemption. In response to the removal of this exemption, Texas Instruments (TI) would like to convey to its customers that TI integrated circuits do not contain DecaBDE. Full statement is located by selecting DecaBDE.

Dimethyl Fumarate (DMF): TI has investigated production materials and has determined that Dimethyl Fumarate CAS # 624-49-7 and Einecs No 210-849-0 is not used and is not present in our Integrated Circuits. Additionally, it is not used in moisture absorbent pillows accompanying TI's products. Full statement is located by selecting DMF.

Perfluorooctane sulfonates (PFOS): TI semiconductor products do not contain as intentional additives perfluorooctane sulfonates (PFOS) as identified in EU Directive 2006/122/EC (30th amendment to EU Directive 76/769/EEC). Full statement is located by selecting PFOS.

Ozone Depleting Substances (ODS): TI does not use Class I or Class II ozone depleting substances (as defined by the U.S. Clean Air Act) as raw materials to manufacture semiconductor products. Some Class I ODSs are used in accordance with the law by TI in closed loop facility infrastructure refrigeration systems for cooling equipment heat exchanger and some Class II ODSs are used in accordance with the law by TI in closed loop refrigeration systems for existing manufacturing equipment heat exchangers. TI carefully monitors these systems and is phasing out use of these substances as we upgrade facilities with new equipment and alternative refrigerants as they become available. TI supports the Montreal Protocol as the guidance document that outlines the controlled phase out of ODSs. TI does not purchase any reclaimed or recycled ODS material. A signed statement is located by selecting ODS.

Red Phosphorous: TI does not supply IC components that use a mold compound containing inorganic (red) phosphorous as an alternative flame retardant system. Full statement is located by selecting Red Phosphorous.

Should you have further questions about this program, please contact your local TI Representative.

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