Quality & Lead-free (Pb-free): Packaging Information

At Texas Instruments, semiconductor packaging is an integral part of the design process and strategic differentiator for our analog and embedded processing products. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.

TI offers a broad packaging portfolio, built upon decades of packaging expertise and supporting thousands of diversified products, packaging configurations and technologies. From traditional BGA and ceramics, to advanced WCSP, PoP, SiP, QFN, flip chip, embedded silicon technologies and more, TI is committed to delivering packaging technologies that advance our products, and meet our customers’ needs today and in the future.

Package Selection Guides  By Package Type  By Industry Standard Terms  By JEDEC Code  By Package Pitch  By Package Max Height  By TI Package Designator

Additional Resources  Find Devices by Package Designator  Related Documents for Packaging  Packaging Terminology  Part Mark Look Up  Former National Semiconductor Marking Conventions  Former National Semiconductor Lead Finish Composition Thickness  Introduction to LLP® (Leadless Leadframe Package)  SMT (Surface Mount Technology) Application Notes  Packaging Technology Development and Manufacturing  Advanced Packaging Technology - Assembly  Industry Standard Term Glossary

Related Links

 Lead-Free Process Solutions

Moisture Sensitivity

In the transition from Leaded to Lead (Pb)-Free products, a common question of interest to semiconductor users is the Moisture Sensitivity Level of the part. The Moisture Sensitivity Level (MSL) is a JEDEC industry standard classification that defines the length of time products can be safely exposed to the ambient environment prior to high-temperature reflow soldering.