No material contents are available for this part.
**Pb-Free or Green Alternative BGA Parts
A Pb-Free or Green version of this BGA device may be available under a new part number. Typically, the package code for a device is embedded in the part number. Package codes Gxx, YEx (where x can be any letter), YE and WAS will be changed to new codes during the conversion to Pb-Free and Green. The new codes are Zxx, YZx, YZ and WAZ. Flip-chip BGA devices may also have a Cxx version which is 100% RoHS compliant (the Zxx version of a flip-chip BGA device is RoHS compliant with an exemption). To learn more, contact your TI sales rep.
Note (1) - Check the Available Supply Dates before ordering. Orders cannot be placed by assembly site.
Note (1A) - PN Type indicates whether a part number is a "Pb-Free" unique PN or a standard TI PN. If you need to order RoHS & high-temp compatible parts and don't want to hassle with date codes, use the "Pb-Free" unique PN when placing orders.
Note (2) - The forecasted or actual conversion date for the specific device package, pin count, & assembly site. See Glossary of Terms for more details.
Note (3) - The forecasted or actual date that the device will be available for purchase.
Note (4) - If a device's material content is less than the thresholds in the Joint Industry Guide (JIG) Level A & Level B substances tables, then "Level A & B" will be displayed. Other options are "Level A ONLY" or "None". For availability of "Level A & B" devices, use the Green Available Supply Date (ASD). For "Level A ONLY" devices, use the Pb-Free ASD.
Note (5) - ppm calculations are at the homogeneous material level and are maximum concentration values. The ppm displayed represents the homogeneous material with the highest ppm for that substance. The amount (mg) calculations represent the maximum total amount of each substance within the component. See Glossary of Terms for more details.
Note (6) - ppm calculations are at the component level and are average concentration values. The amount (mg) calculations represent the average total amount of each substance within the component. See Glossary of Terms for more details.
Note (7) - Reflects the date when a change was last detected in the associated row of information. Change monitoring began 2005-08-11.
Important Part Information
There is a remote possibility the Customer Part Number (CPN) your company uses could reference more than one TI part number. This is due to two or more users (EMSIs or subcontractors) using the same CPN for different TI part numbers. If this occurs, please check your Customer Part Number and cross reference it with the TI part number seen on this page.
Product Content Methodology
For an explanation of the methods used to determine material weights, See Product Content Methodology.
Important Warranty and Disclaimer Information
TI bases its material content knowledge on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information, but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. TI provides an exclusive warranty for certain material content representations in the Material Declaration Certificate for Semiconductor Products, which can be found atwww.ti.com/leadfree. All other material content information is provided "as is."
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