At Texas Instruments, semiconductor packaging is an integral part of the design process and strategic differentiator for our analog and embedded processing products. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.
TI offers a broad packaging portfolio, built upon decades of packaging expertise and supporting thousands of diversified products, packaging configurations and technologies. From traditional BGA and ceramics, to advanced WCSP, PoP, SiP, QFN, flip chip, embedded silicon technologies and more, TI is committed to delivering packaging technologies that advance our products, and meet our customers’ needs today and in the future.
Lead-Free Process Solutions
In the transition from Leaded to Lead (Pb)-Free products, a common question of interest to semiconductor users is the Moisture Sensitivity Level of the part. The Moisture Sensitivity Level (MSL) is a JEDEC industry standard classification that defines the length of time products can be safely exposed to the ambient environment prior to high-temperature reflow soldering.