Quality & Lead-free (Pb-free): Packaging Information

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At Texas Instruments, semiconductor packaging is an integral part of the design process and strategic differentiator for our analog and embedded processing products. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.

TI offers a broad packaging portfolio, built upon decades of packaging expertise and supporting thousands of diversified products, packaging configurations and technologies. From traditional BGA and ceramics, to advanced WCSP, PoP, SiP, QFN, flip chip, embedded silicon technologies and more, TI is committed to delivering packaging technologies that advance our products, and meet our customers’ needs today and in the future.

  Package Selection Guides

 By Package Type

 By Industry Standard Terms

 By JEDEC Code

 By Package Pitch

 By Package Max Height

 By TI Package Designator

  Additional Resources

 Find Devices by Package Designator

 Related Documents for Packaging

 Packaging Terminology

 Part Mark Look Up

 Former National Semiconductor Marking Conventions

 Former National Semiconductor Lead Finish Composition Thickness

 Introduction to LLP® (Leadless Leadframe Package)

 SMT (Surface Mount Technology) Application Notes

 Packaging Technology Development and Manufacturing

pdf logo Advanced Packaging Technology - Assembly

pdf logo Industry Standard Term Glossary

Related Links

 Lead-Free Process Solutions

Moisture Sensitivity

In the transition from Leaded to Lead (Pb)-Free products, a common question of interest to semiconductor users is the Moisture Sensitivity Level of the part. The Moisture Sensitivity Level (MSL) is a JEDEC industry standard classification that defines the length of time products can be safely exposed to the ambient environment prior to high-temperature reflow soldering.