|
|||||||||||||
|
|||||||||||||
12-Bit, 4-Channel MUX Input SAR ADC with Intelligent System Power Control: The ADS7924 is the industry’s first ADC with intelligent system monitoring and self-system monitoring capability. The ADS7924 works with any low-power system that requires sensor monitoring to lower power across the board. Resources: Data sheet, block diagram, EVM, demonstration kit, IBIS model
|
|||||||||||||
Dual 16-Bit, 800-MSPS Communications DAC: The DAC3283 is the smallest (7mm x 7mm, 48-pin QFN) dual 16-bit DAC for driving I/Q transmit chains up to 800MSPS. The device provides up to 80% board space savings per transmit DAC compared to dual-DAC designs while also offering enhanced SFDR and ACPR performance for IFs over 150MHz. Resources: Data sheet, EVM, EVM software, IBIS model
|
|||||||||||||
Back to top | |||||||||||||
|
|||||||||||||
1.5-A, USB-Friendly, Li-Ion Battery Charger and Power-Path Management IC: The bq24072T is a linear, single-cell charger, with a current limit start-up sequence, that features dynamic power path management (DPPM) to power the system while simultaneously and independently charging the battery. The device operates from either a USB port or AC adapter and supports charge currents up to 1.5A. Resources: Data sheet, EVM
|
|||||||||||||
30-V, N-Channel NexFET™ Power MOSFETs: Designed for synchronous buck applications with an input rail of 20V or less, CSD173xx MOSFETs are highly optimized for the most efficient gate drive scheme of 5V Vgs. They also offer the highest efficiency discrete power MOSFETs available, delivering both excellent light-load as well as full-load efficiency. Resources: Data sheet
|
|||||||||||||
Back to top | |||||||||||||
|
|||||||||||||
Stepper Motor Controller IC: The DRV8824 is a dual-bridge device configured to drive a single stepper motor to high degrees of micro-stepping (up to 1/32 step). With its integrated indexer functionality, this easy-to-use device allows for very simple control and driving of a stepper motor while maintaining very high levels of performance. Resources: Data sheet
|
|||||||||||||
Back to top | |||||||||||||
|
|||||||||||||
3.2-W/Ch Stereo SmartGain™ Class-D Audio Amp with Dynamic Range: The TPA2026D2 is a stereo, filter-free Class-D audio power amplifier with volume control, dynamic range compression (DRC) and automatic gain control (AGC) available in a 2.2-mm x 2.2-mm WCSP package. The DRC/AGC function can be configured to automatically prevent distortion of the audio signal and enhance quiet passages that are normally not heard. Resources: Data sheet, EVM, video
|
|||||||||||||
Back to top | |||||||||||||
|
|||||||||||||
Dual-Channel, 0.47-Gbps to 6.25-Gbps Multi-Rate Transceiver: Designed for the wireless base station interconnect between baseband controller and radio head units, the TLK6002 is an off-the-shelf alternative to high-end FPGAs required to deliver the highest data rates required by CPRI and OBSAI wireless infrastructure standards. Resources: Data sheet, block diagram, EVM
|
|||||||||||||
Dual-Channel USB-3.0 Redriver/Equalizer: The SN65LVPE502 single-lane USB-3.0 redriver and signal conditioner supports data rates of 5.0 Gbps. The device is designed to minimize signal degradation effects such as crosstalk and inter-symbol interference (ISI) that limit the interconnect distance between two devices. Resources: Data sheet, block diagram, MLVDS basics video
|
|||||||||||||
Back to top | |||||||||||||
|
|||||||||||||
PurePath™ Wireless 2.4-GHz RF System-on-Chip for Wireless Digital Audio Streaming: The CC8520 enables uncompressed CD-quality wireless audio transmission. The unique combination of a 5-Mbps data rate, a low-latency RF protocol and the industry's most advanced time and frequency diversity scheme enables the most robust audio RF link in the 2.4-GHz band. Resources: Data sheet, development kit, reference design, video
|
|||||||||||||
MSP430™ MCU Combined with Sub-1GHz RF Transceiver for Wireless Networking: The CC430F513x family combines the ultra-low-power MSP430 microcontroller with the high-performance, sub-1GHz CC1101 RF transceiver in devices that offer up to 20 MIPS performance in a 7mm x 7mm package. Supported by a rich developer ecosystem offering complete, scalable hardware and software, the devices support security options such as an integrated AES hardware module. Resources: Data sheet, development tool
|
|||||||||||||
Back to top | |||||||||||||
|
|||||||||||||
TI recently purchased more than 100 tools from Qimonda North America and Qimonda Dresden, Germany as the first step in launching the Phase II expansion of RFAB, the industry’s first 300-mm analog wafer fab, located in Richardson, Texas. When complete, Phase II of RFAB will double the analog manufacturing capacity in the facility, bringing its revenue capability to about $2 billion. The Phase II expansion will give TI a head start in providing our customers access to significant analog capacity to fuel their growth. For more information about TI delivery capacity and analog manufacturing investments, click here. For more information about RFAB, click here. |
|||||||||||||
Back to top | |||||||||||||
|
|||||||||||||
Application Notes: Power Supply Rejection to Noise in Sinusoidal Clock Buffers: CDC3S04 |
|||||||||||||
Different Methods to Drive LEDs Using TPS63xxx Buck-Boost Converters | |||||||||||||
Battery Chargers in USB OTG Devices | |||||||||||||
Reading and Understanding an ESD Protection Datasheet | |||||||||||||
DC Output Errors in a Fully-Differential Amplifier | |||||||||||||
Videos: | |||||||||||||
OPA564: Versatile PLC Applicaton Power Amplifier | |||||||||||||
Op Amp Basics: Input Bias Current | |||||||||||||
TPA2015D1: Boosted Class-D Audio Amp Demo | |||||||||||||
NexFET™ Power Block | |||||||||||||
TI’s PoE Product Portfolio | |||||||||||||
Back to top | |||||||||||||
|
|||||||||||||
“Using SerDes in Fourth Generation Wireless Infrastructure,” by Ajinder Singh. Embedded Systems Design, January 2010. | |||||||||||||
“Point-of-Load: One for All,” by Jeff Sherman and Dirk Gehrke. EETimes, February 2010. | |||||||||||||
“A Simple Solution for Powering LED Streetlights,” by Brian King. ECN, March 2010. | |||||||||||||
“POWER TIP #21: Watch That Capacitor RMS Ripple Current Rating!” by Robert Kollman. Power Management DesignLine, March 2010. | |||||||||||||
“New packaging, MOSFETs meet power supply needs,” by Jeff Sherman. Electronic Products, March 2010. | |||||||||||||
“Ensuring the thermal integrity of your IC package/PC board design,” by Steve Taranovich. Power Management DesignLine, March 2010. | |||||||||||||
“Modeling Electret Condenser Microphones in SPICE,” by Collin Wells. En-Genius, March 2010. | |||||||||||||
“BAKER’S BEST: System or technology dictates ADC choice,” by Bonnie Baker. EDN, March 2010. | |||||||||||||
“Analysis and Measurement of Intrinsic Noise in Op Amp Circuits – Part 10: Instrumentation Amplifier Noise,” by Art Kay. En-Genius, March 2010. | |||||||||||||
Back to top | |||||||||||||
|
|||||||||||||
MAKE/Design News Gadget Freak Design Contest: Sponsored by Texas Instruments, Alibre and Allied Electronics, this contest is an opportunity for you to build a cool gadget and sell it. Create a gadget and document your build. The Contest winner gets $1000 and a chance to sell their gadget in kit form in the Makers Market (with setup and monthly fees waived for 6 months). For more information visit: http://www.makezine.com/gadgetfreakcontest |
|||||||||||||
Back to top | |||||||||||||
|
|||||||||||||
Visit TI’s E2E™ Community and interact with your peer engineers, TI engineers, and other experts in order to ask questions, share knowledge, explore ideas, and help solve problems. | |||||||||||||
|
|||||||||||||
Back to top |
To ensure delivery to your inbox, please add tiprime@dlep14.itg.ti.com to your address book or safe sender list. The platform bar, MSP430, NexFET, PurePath and SmartGain are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. %%DYN_FOOTER%% |