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16-, 14-, 12-Bit, 6-Channel, Simultaneous Sampling Analog-to-Digital Converters: The ADS8556, ADS8557, and ADS8558 SAR ADCs combine the latest generation 16-bit SAR architecture with a software selectable high-voltage front end capable of accepting ±12V inputs. The devices support data rates of up to 730kSPS in parallel interface mode or up to 500kSPS if the serial interface is used. Resources: Data sheet, Video
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Lowest Drift and Widest Operating Temperature, Quad-Channel ±15V High Accuracy DAC: The DAC8734 provides the widest output range, highest temperature range, lowest drift, a programmable output gain, user calibration capability, and the lowest initial error. Available in a 6x6mm package, it is the smallest high accuracy + high voltage bipolar DAC. Resources: Data sheet
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Soundplus™, High-Performance Bipolar-Input Audio Op Amps: The OPA1611 (single) and OPA1612 (dual) bipolar-input op amps achieve very low 1.1-nV/√Hz noise density with an ultra-low distortion of 0.000015% at 1kHz. The devices offer rail-to-rail output swing to within 600mV with a 2-kΩ load, which increases headroom and maximizes dynamic range. Resources: Data sheet
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8-Pin Continuous Conduction Mode (CCM) PFC Controller: The UCC28019 CCM controller is ideal for low-cost PFC applications, producing near unity power factor with little harmonic distortion. It accepts a wide universal input range and is well suited to address power conversion applications from 100W to >2kW. Resources: Data sheet
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2.25-MHz, 92% Efficiency Step-Down Converter: The TPS62750 synchronous step-down DC/DC converter is optimized for USB-powered portable applications, able to provide up to 1300mA average input current. The device supports batteries with extended voltage range of 2.9V to 6.0V. Resources: Data sheet
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600-mA, 6-MHz, Vout 1.8-V, 90% Efficiency Step-Down Converter: The TPS6262x synchronous step-down DC/DC converter, optimized for battery-powered portable applications, supports up to 600-mA load current and allows the use of low-cost chip inductor and capacitors. With a wide input voltage range of 2.3V to 5.5V, the device supports applications powered by Li-Ion batteries; different fixed voltage output versions are available from 1.2V to 2.3V. Resources: Data sheet
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5-Channel Power Management IC with 3 DC/DCs, 2 LDOs in 6x6mm QFN: The TPS6507x are single-chip power management ICs for portable applications consisting of a battery charger with power path management for a single Li-Ion or Li-Polymer cell. Three highly efficient 2.25-MHz, step-down converters are targeted at providing the core voltage, memory and I/O voltage in a processor-based system. Resources: Data sheet
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High-Efficiency PoE Interface and DC/DC Controller: The TPS23757 is a combined Power over Ethernet (PoE) powered device (PD) interface and current-mode DC/DC controller optimized specifically for isolated converters. The device supports a number of input voltage ORing options including highest voltage, external adapter preference, and PoE preference. Resources: Data sheet
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3-V to 20-V High Current Load Switch: The TPS2590 provides robust circuit protection in space-sensitive applications where the load is powered by voltages between 3.0V and 20V. This device is intended for systems where a voltage bus must be protected to prevent load shorts from interrupting or damaging other system components. Resources: Data sheet
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0.5-A, 60-V Step-Up DC/DC Converter with Voltage Supervision and Reset: The TPS55332 is a monolithic high-voltage switching regulator with integrated 3-A, 60-V power MOSFET. Once the internal circuits have stabilized, the system can have an input voltage range from 1.5V to 40V to maintain a fixed boost output voltage. Resources: Data sheet
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50-mA, 3-V to 80-V, Micropower, Low-Dropout Linear Regulator: The TPS798xx is designed for low quiescent current (40-µA operating and 1-µA in shutdown) high voltage (80-V) applications. The TPS798xx includes the ability to operate with low equivalent series resistance (ESR) ceramic output capacitors (only 1-µF ceramic capacitor needed). Resources: Data sheet
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Automotive LIN, MOST ECL, and K-Line Physical Interface: The SN65HVDA195-Q1 is an automotive grade 1-qualified LIN, MOST ECL and ISO9141 (K-Line) physical interface. It is LIN 2.0-compliant, supports MOST ECL speeds down to 0 baud, and is ISO9141 (K-line) compliant. Resources: Data Sheet
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JEDEC SSTE32882-Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test:The SN74SSQEA32882 28-bit 1:2 or 26-bit 1:2 and 4-bit 1:1 registering clock driver with parity is designed for operation on DDR3-registered DIMMs with VDD of 1.5V and on DDR3L-registered DIMMs with VDD of 1.35V. The device implements different power-saving mechanisms to reduce thermal power dissipation and to support system power-down states. Resources: Data sheet, video
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System Block Diagrams: | |||||||||||||
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Literature: SuperSpeed USB Reference Guide: SuperSpeed USB provides a 10x speed increase from 480 Mbps to 5 Gbps. This guide discusses the new technology, issues, features, and applications. |
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Optoelectronics Quick Reference Guide: Discusses the physical media-dependent electronics from TI that provide optical component and system developers with key building blocks such as laser diode drivers, transimpedance amplifiers, post amplifiers and equalizers. | |||||||||||||
Video: TI’s Fusion Power for the Latest Generation of Xilinx FPGAs eLAB Series - Part 1: Introduces TI’s Fusion digital power technology and discusses how to meet the power requirements for Xilinx Spartan-6 and Virtex-6 families. |
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Energy Harvesting Using Thin Film Thermoelectrics: Demonstration of Micropelt’s thin film Thermoelectric technologies used to harvest energy using TI low-power solutions. | |||||||||||||
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“Extended battery life in mobile applications using innovative audio headphone amplifiers,” by Nick Holland. MobileHandsetDesignLine.com, June 2009. | |||||||||||||
“Reducing System Noise with Hardware Techniques,” by Bonnie Baker. EDA Forum, June 2009. | |||||||||||||
“Power Tip: #12: Maximize Power Supply Effiency,” by Robert Kollman. PowerManagementDesignLine.com, June 2009. | |||||||||||||
“Power Tip: #13: Don’t Get Burned by Inductor Core Losses,” by Robert Kollman. PowerManagementDesignLine.com, June 2009. | |||||||||||||
“Baker’s Best: Is your amplifier offset way out of whack?,” by Bonnie Baker. EDN, June 2009. | |||||||||||||
“SCB (Part 30): Protocol Selection Over IEEE 802.15.4 Silicon,” by Brian Blum. RFDesignLine.com, June 2009. | |||||||||||||
“Using fully differential op amps as attenuators, Part 2, Single-Ended Bipolar,” by Jim Karki. TI Analog Applications Journal, July 2009. | |||||||||||||
“How the voltage reference affects ADC performance, Part 2,” by Bonnie Baker and Miro Oljaca. TI Analog Applications Journal, July 2009. | |||||||||||||
“Taming linear-regulator inrush currents,” by Jeff Falin. TI Analog Applications Journal, May 2009. | |||||||||||||
“Selecting the right charge management solution,” by Masoud Beheshti. Analog Applications Journal, May 2009. | |||||||||||||
“Designing a linear Li-Ion battery charger with power-path control,” by Charles Mauney. Analog Applications Journal, May 2009. | |||||||||||||
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TI E2E Online Community: Visit TI’s Online Community and interact with your peer engineers, TI engineers, and other experts in order to ask questions, share knowledge, explore ideas, and help solve problems. |
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